Sometimes, manufactures define packages that are modified versions of standard packages.
For example: https://www.infineon.com/package/PG-DSO-12-24
This package is like SOIC127P600X175-16, but with four pins removed.
Should the footprint (pad dimensions) match the manufacturer's? Or should it follow how the rest of LibrePCB's SOIC packages are made?
Sometimes, manufactures define packages that are modified versions of standard packages.
For example: https://www.infineon.com/package/PG-DSO-12-24
This package is like SOIC127P600X175-16, but with four pins removed.
Should the footprint (pad dimensions) match the manufacturer's? Or should it follow how the rest of LibrePCB's SOIC packages are made?