fix(bonding): add missing svg sources

fix(bonding): die orientation hint for qfn64

feat: qfn bonding diagrams

docs: add project index and bond diagrams

feat: do minimal DRC both with and without seal+fill

fix: flush stdout in add-fill.py

ci: add fill and seal+fill as artifacts

feat: redraw the logo so that it doesn't need slits

feat: add more slits to the logo

ci: split flow into parts to mitigate GHA cutting off the logs

fix: keep platform update in sync between GHA & local workflow

feat: move fill generation from gds job to drc

feat: allow changing file name in fill & seal scripts

feat: enable maximal drc without seal ring and fill

feat: increase Metal2 minimum area in tech lef

fix: correct off-grid passiv layer in bond pad macro

style: convert gds.yaml to unix line endings

feat: use a python script to add the seal ring (instead of ORFS)

feat: convert seal ring to static cell

feat: add metal slits to TT logo

fix(tt_um_kianV_rv32ima_uLinux_SoC): apply patch from Hirosh

fix(tt_um_kianV_rv32ima_uLinux_SoC): apply patch from Hirosh

fix(tt_um_kianV_rv32ima_uLinux_SoC): apply patch from Kian

feat(formal): pin oss-cad-suite to a specific version

ci(formal): fix deprecation warning

feat: pin ORFS and IHP PDK to specific commits

fix: adapt update-branches.sh to config.mk

feat: set config for small version without logo

feat: enable user projects / tt_logo by default