Why are the TempMem sections (mailbox, stack and heap) included as part of the binary image?

[BenDHillier]

I found it odd while using Intel's MigTD, that the binary file, which is a td-shim, has gaps in the binary for the TempMem sections. I don't believe there's a need for this, as TDVF metadata should allow for discontiguous firmware memory. Was this an intentional decision?

[jyao1]

gap is not required.