Incorporating TSV element as layer_changing element

[Qvadi]

Hi,
I also noticed that the TSVstandard element is not part of the layer_changing_element list. Can this also be part of the waveguide_composite element class? Would be super useful. I tried adding it and playing with the code a bit but the problem I encounter is mainly coming from the TSV element not having ports. Can it be simply added with co-incident ports, same as the base ref_point?

[iqmtestd]

Hi,

Yes, I agree, the same idea has passed my mind too.

The usual way to change faces with WaveguideComposite is to use the face_id="2b1" Node parameter. This works fine automatically using the FlipChipConnectorRf element. For example, you may use this (-200, 0),(0, 0, {"face_id": "2b1" }), (200, 0) node_list "manually" in WaveguideComposite to see it working:

I think the face_id="1b1" Node argument, could do the same thing but using a TSV element. We'll see what we can do about this.

[Qvadi]

Hi team KQC, any workarounds that you can suggest?

[qpavsmi]

Here is what I managed to get working using the "Standard TSV element". In defaults.py enable the element to be selected in the GUI "Edit node" tool by adding 'TsvStandard' to both node_editor_valid_elements and node_editor_layer_changing_elements. Then in elements/tsvs/tsv_standard.py add the following lines at the end of the build function:

        self.add_port("{}_port".format(self.face_ids[0]), pya.DPoint(0, 0))
        self.add_port("{}_port".format(self.face_ids[1]), pya.DPoint(0, 0))

I get something like this:

A literal hole in the wire, so maybe not something that we want to fabricate.

You might want to create an element of your own into a new file (use FlipChipConnectorRf as an example code) that defines a hole in the "through_silicon_via" layer and some geometry in the "base_metal_gap" layer supporting it. Then add the two ports I copy-pasted above in the locations that you want so that it can be as part of the WaveguideComposite.

Hope this helps.

[Qvadi]

Thanks for the suggestion. It works. I am building on the flip_chip connector module to realize something similar with TSVs.