Question for Fire 32 build in pcbway

[jsantcl]

Hello!, tried to get a quote for fire 32b2 build, got the following questions from pcbway staff, please, could anyone help me on the questions?

Used the gerber file from https://github.com/piersfinlayson/one-rom/tree/main/hardware/pcb/verified/fire-32-b2

bom file used fire-32-b2-bom.csv

Thanks!

For image.png

"As shown in the image, the distance between two pads is 0.18mm, not enough for producing green soldermask bridge, as the required value is 0.19mm, in that case, please confirm if we can make entire soldermask opening for the similar area where the distance between each two pads is less than 0.19mm? In other words, there will have no soldermask bridge produced between each two pads on certain areas."

For image2.png

"See image2, for these holes designed on SMD pads, pls confirm whether these vias shoud be filled with resin for better soldering quality?(The price will be increased) If not, there is a risk of cold joint when soldering the components on board. If you want us to fill vias with resin, then please confirm if we should process it for only these vias designed on SMD pads or for all the vias? There is no difference in price between these two options."

[piersfinlayson]

As shown in the image, the distance between two pads is 0.18mm,

This is concerning. They are referring here to the distance between the pads on the RP2350B. This layout uses Raspberry Pi's own RP2350 footprint, so the pad sizes and gaps between them are as recommended by Raspberry Pi. If PCBWay have a problem with this aspect of the layout I would be concerned about their ability to probably fab and assemble any RP2350-based board.

Personally, I would go back to them and tell them what I've just said.

confirm if we can make entire soldermask opening for the similar area where the distance between each two pads is less than 0.19mm

I think this means that the distance between every pair of pads is 0.18mm (it is), so they are saying there will be no soldermask between the RP2350's pads. This increases the risk of solder bridges between pins underneath the RP2350 itself.

for these holes designed on SMD pads, pls confirm whether these vias shoud be filled with resin for better soldering quality

They're probably talking about the via in the 5V pad of the RGB LED's bypass cap. I very much doubt you need to bother with having this hole resin filled. I've not had any issues with this on any of my 100+ 32b2, and that cap probably isn't strictly necessary anyway.

Worth saying that JLC flag neither of these as being an issue. I don't actually know whether JLC soldermask between the pads of the RP250.

[artgodwin]

It may be that jlcpcb don't check that dimension. Pcbway have started recently - I had ordered some PCBs for another project with a white soldermask. I re-ordered a couple of months later and was told the white soldermask didn't have enough resolution. I was able to increase the spacing as I needed to use white (and I think green was less fussy) but I would think they have started checking in order to get a better yield. So they may also have started to check that clearance on green soldermask and I don't know if jlcpcb do that.

…

On Sun, Aug 2, 2026 at 10:58 AM Piers Finlayson ***@***.***> wrote: As shown in the image, the distance between two pads is 0.18mm, This is concerning. They are referring here to the distance between the pads on the RP2350B. This layout uses Raspberry Pi's own RP2350 footprint, so the pad sizes and gaps between them are *as recommended* by Raspberry Pi. If PCBWay have a problem with this aspect of the layout I would be concerned about their ability to probably fab and assemble any RP2350-based board. Personally, I would go back to them and tell them what I've just said. confirm if we can make entire soldermask opening for the similar area where the distance between each two pads is less than 0.19mm I think this means that the distance between every pair of pads is 0.18mm (it is), so they are saying there will be no soldermask between the RP2350's pads. This increases the risk of solder bridges between pins underneath the RP2350 itself. for these holes designed on SMD pads, pls confirm whether these vias shoud be filled with resin for better soldering quality They're probably talking about the via in the 5V pad of the RGB LED's bypass cap. I very much doubt you need to bother with having this hole resin filled. I've not had any issues with this on any of my 100+ 32b2, and that cap probably isn't strictly necessary anyway. Worth saying that JLC flag neither of these as being an issue. I don't actually know whether JLC soldermask between the pads of the RP250. — Reply to this email directly, view it on GitHub <#280?email_source=notifications&email_token=AAFFOGMW2Y2N4BYCH5TAA7L5H4GEBA5CNFSNUABIM5UWIORPF5TWS5BNNB2WEL2ENFZWG5LTONUW63SDN5WW2ZLOOQXTCNZYGY4TCNZZUZZGKYLTN5XKU43VMJZWG4TJMJSWJJLFOZSW45FMMZXW65DFOJPWG3DJMNVQ#discussioncomment-17869179>, or unsubscribe <https://github.com/notifications/unsubscribe-auth/AAFFOGO3HPREOMWIQUGIKT35H4GEBAVCNFSNUABIKJSXA33TNF2G64TZHM4TONRSGU4TKMJTHNCGS43DOVZXG2LPNY5TCMBVGM4DEMRVUF3AE> . Triage notifications, keep track of coding agent tasks and review pull requests on the go with GitHub Mobile for iOS <https://github.com/notifications/mobile/ios/AAFFOGJ47SVINZYW4XF3JS35H4GEBA5CNFSNUABIM5UWIORPF5TWS5BNNB2WEL2ENFZWG5LTONUW63SDN5WW2ZLOOQXTCNZYGY4TCNZZUZZGKYLTN5XKU43VMJZWG4TJMJSWJJLFOZSW45FKMZXW65DFOJPWS33T> and Android <https://github.com/notifications/mobile/android/AAFFOGOEE6CYD6YHKEVNUSD5H4GEBA5CNFSNUABIM5UWIORPF5TWS5BNNB2WEL2ENFZWG5LTONUW63SDN5WW2ZLOOQXTCNZYGY4TCNZZUZZGKYLTN5XKU43VMJZWG4TJMJSWJJLFOZSW45FOMZXW65DFOJPWC3TEOJXWSZA>. Download it today! You are receiving this because you are subscribed to this thread.Message ID: ***@***.*** com>

[piersfinlayson]

I checked and JLC list the min pad spacing as 0.10mm on 1oz boards with most colours (black and white being 0.13).

[jsantcl]

Hey! Thanks for your reply,

I'll check with jlc, got the following quotation file from pcbway before replying to their questions, now I don't get why they wanted to confirm that before.
T-1L30W552903A-5units-fire-32-b2-bom(2026-08-01).xls

In this file there is a note that the RP2350B is changed by RP2354B.

Are the two files in my first post all the required information to get the board build or am I missing something (gerber and bom)?

Thanks very much.

[piersfinlayson]

The footprint is named RP2350B - the part itself is the RP2354B. You definitely need the RP2354B.

To fab with JLC you need the gerbers, the BOM and the POS files - all are in the same directory in the repo.

There's some notes on using JLC here:

https://github.com/piersfinlayson/one-rom/tree/main/hardware/pcb

Make sure you select both top and bottom components to be assembled.

[piersfinlayson]

Not trying to dissuade you from having your own made, but for 5 you might find it cheaper to buy from https://shop.piers.rocks. Probably depends where you're based.

[jsantcl]

Hello!, thanks for your help, I'm from Chile, it's expensive to get things shipped here, I used pcbway before because you can get things shipped using aliexpress or CN post ( cheaper), also they collect taxes so your package don't get lost in customs. I'll investigate if JLC have such shipping option. There is no shipping options for my address in your shop.

By the way, my use case for onerom is try to restore my old pentiums ( first gen pentium and mmx p5), saw someone got a 486 working.

[piersfinlayson]

I've added Chile as a supported shipping destination in case it is helpful.

However, I can't collect taxes/duties for Chile, so those would still be payable when you receive your package.