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200 | 200 | )
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201 | 201 |
|
202 | 202 | (stroke (width 0) (type default)) (fill solid) (layer "F.Fab") (tstamp b7d278e3-ce0e-4b85-8d84-82119c33e070))
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203 |
| - (pad "1" smd rect (at -2.75 -1.35) (size 0.3 0.8) (layers "F.Cu" "F.Mask") |
| 203 | + (pad "1" smd rect (at -2.75 -1.35) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask") |
204 | 204 | (solder_mask_margin 0.07) (thermal_bridge_angle 0) (tstamp 2169ec83-7a57-457c-844c-110fafe02bf2))
|
205 |
| - (pad "2" smd rect (at -2.25 -1.35) (size 0.3 0.8) (layers "F.Cu" "F.Mask") |
| 205 | + (pad "2" smd rect (at -2.25 -1.35) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask") |
206 | 206 | (solder_mask_margin 0.07) (thermal_bridge_angle 0) (tstamp fea9ce40-0ad7-44ff-82d7-1d86954fd459))
|
207 |
| - (pad "3" smd rect (at -1.75 -1.35) (size 0.3 0.8) (layers "F.Cu" "F.Mask") |
| 207 | + (pad "3" smd rect (at -1.75 -1.35) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask") |
208 | 208 | (solder_mask_margin 0.07) (thermal_bridge_angle 0) (tstamp cdc83f06-ab4c-484a-98e9-b0961dd5d6a6))
|
209 |
| - (pad "4" smd rect (at -1.25 -1.35) (size 0.3 0.8) (layers "F.Cu" "F.Mask") |
| 209 | + (pad "4" smd rect (at -1.25 -1.35) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask") |
210 | 210 | (solder_mask_margin 0.07) (thermal_bridge_angle 0) (tstamp 40857cb4-7079-4e82-b4ac-9fb6883691a0))
|
211 |
| - (pad "5" smd rect (at -0.75 -1.35) (size 0.3 0.8) (layers "F.Cu" "F.Mask") |
| 211 | + (pad "5" smd rect (at -0.75 -1.35) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask") |
212 | 212 | (solder_mask_margin 0.07) (thermal_bridge_angle 0) (tstamp dc180c2a-6e31-4e88-ad6d-2564f0d7dc6b))
|
213 |
| - (pad "6" smd rect (at -0.25 -1.35) (size 0.3 0.8) (layers "F.Cu" "F.Mask") |
| 213 | + (pad "6" smd rect (at -0.25 -1.35) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask") |
214 | 214 | (solder_mask_margin 0.07) (thermal_bridge_angle 0) (tstamp 2b6c7f78-92c5-467c-b5d8-a97753dff805))
|
215 |
| - (pad "7" smd rect (at 0.25 -1.35) (size 0.3 0.8) (layers "F.Cu" "F.Mask") |
| 215 | + (pad "7" smd rect (at 0.25 -1.35) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask") |
216 | 216 | (solder_mask_margin 0.07) (thermal_bridge_angle 0) (tstamp 6ee6ef3e-14db-4c59-baa6-ad84fa6c2690))
|
217 |
| - (pad "8" smd rect (at 0.75 -1.35) (size 0.3 0.8) (layers "F.Cu" "F.Mask") |
| 217 | + (pad "8" smd rect (at 0.75 -1.35) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask") |
218 | 218 | (solder_mask_margin 0.07) (thermal_bridge_angle 0) (tstamp f5927888-aa4e-4ac8-840f-bcf7e5e26812))
|
219 |
| - (pad "9" smd rect (at 1.25 -1.35) (size 0.3 0.8) (layers "F.Cu" "F.Mask") |
| 219 | + (pad "9" smd rect (at 1.25 -1.35) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask") |
220 | 220 | (solder_mask_margin 0.07) (thermal_bridge_angle 0) (tstamp 1f617e94-6db5-40fd-a09b-15c005ff3a3f))
|
221 |
| - (pad "10" smd rect (at 1.75 -1.35) (size 0.3 0.8) (layers "F.Cu" "F.Mask") |
| 221 | + (pad "10" smd rect (at 1.75 -1.35) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask") |
222 | 222 | (solder_mask_margin 0.07) (thermal_bridge_angle 0) (tstamp cefca530-8acc-458e-9785-f43fd65d8891))
|
223 |
| - (pad "11" smd rect (at 2.25 -1.35) (size 0.3 0.8) (layers "F.Cu" "F.Mask") |
| 223 | + (pad "11" smd rect (at 2.25 -1.35) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask") |
224 | 224 | (solder_mask_margin 0.07) (thermal_bridge_angle 0) (tstamp 161a2070-1e03-4380-894b-785deadb0238))
|
225 |
| - (pad "12" smd rect (at 2.75 -1.35) (size 0.3 0.8) (layers "F.Cu" "F.Mask") |
| 225 | + (pad "12" smd rect (at 2.75 -1.35) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask") |
226 | 226 | (solder_mask_margin 0.07) (thermal_bridge_angle 0) (tstamp 82dc4965-9c98-451a-9273-bd222a419484))
|
227 | 227 | (pad "MP1" smd rect (at -3.75 1.15) (size 0.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
|
228 | 228 | (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp a7219dfa-b9b2-41cd-be31-e9594cfa2aab))
|
|
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