test: add pcb snapshot test for polygon smtpads with solder mask coverage #327
Workflow file for this run
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| name: Release Tracker - Feature Merge | |
| on: | |
| pull_request: | |
| types: [closed] | |
| jobs: | |
| track-feature-merge: | |
| if: github.event.pull_request.merged == true && github.event.pull_request.base.ref == 'main' | |
| runs-on: ubuntu-latest | |
| steps: | |
| - name: Send feature merge event | |
| continue-on-error: true | |
| run: | | |
| FEATURE_NAME=$(echo "${{ github.event.pull_request.user.login }}: ${{ github.event.pull_request.title }} #${{ github.event.pull_request.number }}" | jq -R .) | |
| curl -X POST https://release-tracker.tscircuit.com/release_events/create \ | |
| -H "Content-Type: application/json" \ | |
| -d "{ | |
| \"event\": { | |
| \"event_type\": \"feature_merged\", | |
| \"repo\": \"tscircuit/core\", | |
| \"feature_name\": $FEATURE_NAME | |
| } | |
| }" |