v1.2.2

This Release v1.2.2 includes PCB design updates aimed at simplifying manufacturing with popular PCBA service providers and reducing overall production costs:

• Adjusted IC footprints on the Acquisition PCB to use a minimum via hole size of 0.3 mm (previously 0.2 mm), improving compatibility with standard manufacturing processes (#33 )

• Revised accelerometer footprint on the Acquisition PCB to allow for minimal solder mask slivers, making assembly easier and more reliable.

v1.2.1

The release v1.2.1 contains PCBs stack ups updates to simplify manufacturing with popular PCBA service providers:

• Updated Acquisition PCB and HV PCB stack ups.
• Adjusted RF trace width according to the stack up to keep 50ohm impedance.
• Updated the Gerber files and stack up information for both Acquisition PCB and HV PCB.

v1.2.0

The release v1.2.0 of the WULPUS platform includes the following changes:

Added

• Fabrication instructions for the WULPUS silicone package (refer to WULPUS User Manual Rev. 2).
• Source design files for the WULPUS silicone package (/hw/wulpus_silicone_package).
• Updated repository description and an expanded list of contributors in README.md.
• Added new publications utilizing the WULPUS probe to README.md.

Fixed

• Resolved multiple inaccuracies in WULPUS User Manual Rev. 1 (#13, #15, #18, #22).
• Fixed issue #17: Power supply spikes exceeding resistor power ratings. Added enable pin control for U1 of Acquisition PCB.
• Addressed issue #21: Improved antenna layout for better performance.
• Updated acquisition PCB layout and production files accordingly.

Changed

• Replaced chip antenna on the Acquisition PCB and updated the matching circuit.

Removed

• Removed mounting hole on the Acquisition PCB to allow for RF routing and antenna matching network adjustments.

v1.1.0

The stabilization release (v1.1.0) of the WULPUS platform includes the following changes:

Added

• WULPUS User Manual Rev 1 (docs/wulpus_user_manual.pdf)
• MSP430 firmware (located at fw/msp430)
• WULPUS programmer PCBs' design files (located at hw/wulpus_programmer_pcbs).
• Generated production files (Assembly drawings, BOM, Gerber files, Drill files, Pick&Place files) for all the PCBs.
• Dedicated GUIs to configure the excitation/receive and measurement settings.
• Example configurations and raw data.

Fixed

• BLE Package loss by implementing buffering on the nRF52 MCU.
• Multiple GUI bugs.

Changed

• Updated the design of the acquisition and high-voltage PCBs (backward compatible with v1.0.0)
• Improved the schematics of the PCB projects to simplify the outsourced assembly.
• Improved the main WULPUS GUI and the example script.

Removed

• Removed ./sw/docs folder with the old GUI guide. The information about the GUI is now available in the WULPUS user manual.

v1.0.0

Initial WULPUS release includes:

• source code for the nRF52832 MCU of the WULPUS probe
• source code for the nRF52840 USB dongle
• Python code for the WULPUS Graphical User Interface
• Altium designer source files, pdf schematics, BOM lists for
  • WULPUS Acquisition PCB
  • WULPUS High-Voltage PCB