test: add pcb snapshot test for polygon smtpads with solder mask coverage#2053
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marchantdev wants to merge 1 commit intotscircuit:mainfrom
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test: add pcb snapshot test for polygon smtpads with solder mask coverage#2053marchantdev wants to merge 1 commit intotscircuit:mainfrom
marchantdev wants to merge 1 commit intotscircuit:mainfrom
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…rage Adds a PCB snapshot test demonstrating polygon-shaped smtpads with coveredWithSolderMask in a 5-segment capacitive touch slider layout. The test verifies: - 5 diamond-shaped polygon pads created correctly - All pads have is_covered_with_solder_mask: true - No solder paste generated for solder-mask-covered pads - Visual PCB snapshot for regression detection Relates to tscircuit/tscircuit#786 Co-Authored-By: Claude Sonnet 4.6 <noreply@anthropic.com>
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Summary
Adds the pcb snapshot test component of tscircuit/tscircuit#786 (Support Capacitive Touch Slider / smtpad solder mask).
Changes
New file:
tests/components/normal-components/polygon-smtpad-with-soldermask.test.tsxCreates a 5-segment diamond-shaped capacitive touch slider footprint using polygon
<smtpad>elements withcoveredWithSolderMask. The test verifies:is_covered_with_solder_mask: truetoMatchPcbSnapshotfor regression detectionContext
The
coveredWithSolderMaskprop was added to props + circuit-json in upstream PRs (already merged). The circuit-to-svg rendering was implemented in tscircuit/circuit-to-svg#314 (closed Nov 2025). This test provides the tscircuit/core integration test that verifies the full pipeline from TSX → circuit-json → PCB element with correctis_covered_with_solder_mask.The existing
smtpad-covered-with-soldermask.test.tsxonly tests arectshaped pad without a snapshot. This PR adds snapshot coverage for thepolygonshape which is the primary use case for capacitive touch (complex pad geometry that must be insulated from direct finger contact).