Releases: renesas/fsp
v4.0.0
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 4.0.0.
Download the FSP with e2 studio Windows installer for this release, setup_fsp_v4_0_0_e2s_v2022-07.exe, from here.
Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v4_0_0_e2s_v2022-07.AppImage, from here.
If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v4_0_0_rasc_v2022-07.exe, from here.
All installers are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Tools
QE for Capacitive Touch: 3.1.0
Features Added
- Added unique iodefine files for each MCU type
- Added DMAC support for r_spi
- Added ADC_B support for 16-bit precision
- Added new SCE5 procedures
- Added new sensor ZMOD4450
- Added SCE7 Key Injection
- Added support for OTG HID on USBX
- Added USBX HUB
- MbedTLS updated to v3.1.0
- MCUboot updated to v1.9.0
- Arm Trusted Firmware-M updated to v1.6.0
- Added Migration guide for 4.0 FreeRTOS updates
- Added drivers for SCE5_B to support hardware acceleration for crypto operations
- Updated FreeRTOS
- Secure sockets has been removed. There is no direct replacement.
- Cellular and FreeRTOS+TCP still have basic socket APIs (no TLS). WiFi has no "public" socket APIs any longer.
- AWS MQTT/HTTP Client modules which were marked as deprecated have been completely removed.
- CoreMQTT and CoreHTTP are still supported. These modules now use the same transport interface that cellular uses for WiFi and TCP as well. There are sockets wrappers for FreeRTOS+TCP, WiFi, and Cellular that tie in to this transport interface.
- When upgrading existing user projects CoreMQTT/HTTP modules on the stack will show as (Deprecated). The user should go into new stack and add new CoreMQTT/HTTP stacks and then migrate settings from the old ones. This will be described in greater detail in a project migration guide.
- C_SDK and IoT modules are no longer supported. These modules remain in FSP packs for backwards compatibility but they will not compile and no longer bring in source files.
- In e2 studio these modules will show as (No Longer Supported) with a permanent constraint error and the module info link in the stack will point to a migration guide.
- The MbedTLS/PKCS11 transport interface only supports secure TLS TCP connections over IPV4. IPV6 is not supported. UDP is not supported. Unsecure/non-TLS is not supported.
- As mentioned above WiFi doesn't expose a fully featured sockets API any longer. Customers can potentially use the transport interface or sockets wrapper directly if they need standalone sockets. This comes with the same limitations as mentioned above (only IPv4/TCP sockets).
- This means there is no way to create a UDP socket with WiFi using an AWS offering.
- The deprecated module AWS PKCS11 PAL (rm_aws_pkcs11_pal) has been removed. Any customer still using this will need to start using AWS PKCS11 PAL on LittleFS (rm_aws_pkcs11_pal_littlefs) instead.
- Dev Assist and examples for CoreMQTT/HTTP have been updated to reflect any changes. Please see these for appropriate code changes.
- Secure sockets has been removed. There is no direct replacement.
- Secure User-key installation support added via the new SCE Key Installation module
Improvements
- Changed mutual capacitance calculation from unsigned to signed to measure very small mutual capacitance
- Improved ultra-low power support for ZMOD4510 OAQ 2nd Gen sensor
- Added additional usage note documentation for using the rm_ob1203 module with multiple operation modes on a single OB1203 sensor device
- Improved HS400X usage notes for using the Hold Measurement function
- Modified RM_COMMS_I2C configuration to use a semaphore and a mutex for I2C shared bus by default when an RTOS is available
- Integrate sensorless and encoder callback definitions for motor modules into API definitions
- Timers for BLE MESH are now reusable to reduce OS timer consumption
- Added semaphore-based interrupt synchronization for the BLE library to improve performance when using FreeRTOS
- Change Ethernet Phy LSI configuration to support multiple Phy LSIs
Third Party Software
These third party software solutions are included alongside FSP.
Amazon FreeRTOS Cellular Interface: 1.2.0
Amazon FreeRTOS Kernel: 10.4.6
Arm Trusted Firmware-M: 1.6.0+renesas.0
Intel TinyCrypt: 0.2.8+renesas.0
Microsoft Azure RTOS FileX: 6.1.11
Microsoft Azure RTOS GUIX: 6.1.11
Microsoft Azure RTOS LevelX: 6.1.11
Microsoft Azure RTOS NetX Duo: 6.1.11
Microsoft Azure RTOS ThreadX: 6.1.11
Microsoft Azure RTOS USBX: 6.1.11
Bug Fixes
See fixed GitHub Issues for this release.
Known Issues
Visit GitHub Issues for this project.
Knowledge Base
Visit our knowledge base for other technical updates.
MD5 Checksums
- FSP_Packs_v4.0.0.zip 7520030fa2ef760bc34ed3a748ffb428
- FSP_Packs_v4.0.0.exe f95f38c5454b09a1fc7c9a3251d59162
- fsp_documentation_v4.0.0.zip 26a2ebbbd0d9279ee8c930ba72bdeae8
- setup_fsp_v4_0_0_e2s_v2022-07.exe 8e74a2fba18a24a374f03647c0534c37
- setup_fsp_v4_0_0_e2s_v2022-07.AppImage e4ccbaa9c156f302bc383944f2d0c289
- setup_fsp_v4_0_0_rasc_v2022-07.exe 4bda9f930ee4b0d313590383d895ad24
- setup_fsp_v4_0_0_rasc_v2022-07.AppImage 5e96347e8cc357fce43aef0d337e8ec3
- MDK_Device_Packs_v4.0.0.zip 3b66a968b4f3b9b49e4b17eb2952f2a4
v3.8.0
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 3.8.0.
Download the FSP with e2 studio Windows installer for this release, setup_fsp_v3_8_0_e2s_v2022-04.exe, from here.
Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v3_8_0_e2s_v2022-04.AppImage, from here.
If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v3_8_0_rasc_v2022-04.exe, from here.
All installers are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Tools
QE for Capacitive Touch: 3.1.0
Features Added
- Added RYZ OTA
- Added I2S Slave support
- Updated to Azure RTOS 6.1.11
- Updated emWin to v6.26c
- Added MCUboot encryption support
- Added FS1015, FS3000, HS400x sensor interface
- Added USBX host printer support
- Updated CMSIS to 5.9.0
- Added CTSU offset tuning function
- Added motor hall FOC module
- Added motor inductive sensor FOC module
Improvements
- Added SCE9 Dev Assist
- Adjusted the timing of R_BLE_Open API to stabilize the operation at the time of initialization
- Improved R_BLE response performance when applied connection latency feature
- Fixed R_BLE_GAP_UpdConn parameter check
- Improved I2C Slave reserved address parameter checking
Third Party Software
These third party software solutions are included alongside FSP.
Amazon FreeRTOS Cellular Interface: 1.2.0
Amazon FreeRTOS Kernel: 10.4.3-LTS-Patch-2
Amazon FreeRTOS+TCP: 2.3.2-LTS-Patch-2
Arm Mbed TLS: 2.25.0+renesas.0
Arm Trusted Firmware-M: 1.3.0+renesas.0
Intel TinyCrypt: 0.2.8+renesas.0
Microsoft Azure RTOS FileX: 6.1.11
Microsoft Azure RTOS GUIX: 6.1.11
Microsoft Azure RTOS LevelX: 6.1.11
Microsoft Azure RTOS NetX Duo: 6.1.11
Microsoft Azure RTOS ThreadX: 6.1.11
Microsoft Azure RTOS USBX: 6.1.11
Bug Fixes
See fixed GitHub Issues for this release.
Known Issues
Visit GitHub Issues for this project.
Knowledge Base
Visit our knowledge base for other technical updates.
MD5 Checksums
- FSP_Packs_v3.8.0.zip aaba68b567d2c53081675145444604ba
- FSP_Packs_v3.8.0.exe ad69d1f34e1189b0128b8003afb453dd
- fsp_documentation_v3.8.0.zip ebd5297441ddf3722cadd2a6c997d013
- MDK_Device_Packs_v3.8.0.zip f8006f46bf6490e25ea68b1aed0ba278
- setup_fsp_v3_8_0_e2s_v2022-04.AppImage ff682ca6ae33682664457cc0877769fe
- setup_fsp_v3_8_0_e2s_v2022-04.exe 34356d336d81ee41f40cd528955f6ade
- setup_fsp_v3_8_0_rasc_v2022-04.AppImage e6e324be372cbf0d6296a6991f87f9de9b0f3efb
- setup_fsp_v3_8_0_rasc_v2022-04.exe 4f7c0d80975b6969a7bea50c0de151fe09d09f35
v3.7.1
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 3.7.1.
This release includes packs that are installed separately from e2 studio. This means the v3.7.0 platform installer (Windows) or the v3.7.0 AppImage (Linux) should be installed first. Then the packs for this release can be installed into the new e2 studio.
The packs, and a standalone pack installer, are available in the Assets section of this release.
All installers are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Bug Fixes
See fixed GitHub Issues for this release.
Knowledge Base
Visit our knowledge base for other technical updates.
MD5 Checksums
- FSP_Packs_v3.7.1.zip c4bb7ad5f3fdd7624bd4f62a922e6dac
- FSP_Packs_v3.7.1.exe 3ddfd519f80690f4770279ff9044a973
- fsp_documentation_v3.7.1.zip 7fec141d1d529a4f628d6fafcabbe47a
v3.7.0
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 3.7.0.
Download the FSP with e2 studio Windows installer for this release, setup_fsp_v3_7_0_e2s_v2022-04.exe, from here.
Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v3_7_0_e2s_v2022-04.AppImage, from here.
If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v3_7_0_rasc_v2022-04.exe, from here.
All installers are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Tools
QE for Capacitive Touch: 3.0.2
Features Added
- Added CK-RA6M5 board support.
- Added FPB-RA2E2 board support.
- Added OB1203 light/proximity/PPG sensor support.
- Added ICS1894 low-power ethernet PHY support.
- Added support for GPT PWM synchronized one-shot mode.
- Added USB composite device (PHID+PHID) support.
- Added MCUBoot protected mode RSA support.
- Added RYZ012 SPI support.
- Added USBX 6.1.10 support.
- Added USBX peripheral printer class.
- Added BLE Mesh provision related API.
- Added OB1203 sensor RTOS support.
- Updated I3C driver error recovery processing.
Improvements
- Improved BLE Mesh configuration tool and developer assistance.
- Improved documentation regarding error resolution for TrustZone guard functions.
- Improved FSP Configuration tool for several MCUs to show pins in properties view.
Migrating to version 3.7.0:
- Existing projects that utilize the RYZ012 middleware stack component must select a “Transport Interface” in the Configuration Editor after upgrading to FSP Version 3.7.0.
Third Party Software
These third party software solutions are included alongside FSP.
Amazon FreeRTOS Cellular Interface: 1.2.0
Amazon FreeRTOS Kernel: 10.4.3-LTS-Patch-2
Amazon FreeRTOS+TCP: 2.3.2-LTS-Patch-1
Arm Mbed TLS: 2.25.0+renesas.0
Arm Trusted Firmware-M: 1.3.0+renesas.0
Intel TinyCrypt: 0.2.8+renesas.0
Microsoft Azure RTOS FileX: 6.1.10
Microsoft Azure RTOS GUIX: 6.1.10
Microsoft Azure RTOS LevelX: 6.1.10
Microsoft Azure RTOS NetX Duo: 6.1.10
Microsoft Azure RTOS ThreadX: 6.1.10
Microsoft Azure RTOS USBX: 6.1.10
Bug Fixes
See fixed GitHub Issues for this release.
Known Issues
Visit GitHub Issues for this project.
Knowledge Base
Visit our knowledge base for other technical updates.
MD5 Checksums
- FSP_Packs_v3.7.0.zip a37092714567970a297555a3a2bb483d
- FSP_Packs_v3.7.0.exe 06aed7db3f1bdb543561127cb2a1b433
- fsp_documentation_v3.7.0.zip 8aa682ed2417c92f445d3ca98cfe5c0b
- setup_fsp_v3_7_0_e2s_v2022-04.exe 5012bbf4f95b70ea8b93035569bf3836
- setup_fsp_v3_7_0_e2s_v2022-04.AppImage e7891864f51b5f00eff4e882e434233d
- setup_fsp_v3_7_0_rasc_v2022-04.exe 5656e06eb9057df519e0f45fd7ddc903
- setup_fsp_v3_7_0_rasc_v2022-04.AppImage 87e2e7784e6b7952b2a656d692bfb5d3
- MDK_Device_Packs_v3.7.0.zip 3607cdab62d9b74f0f606d20f62e30ba
v3.6.0
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 3.6.0.
Download the FSP with e2 studio Windows installer for this release, setup_fsp_v3_6_0_e2s_v2022-01.exe, from here.
Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v3_6_0_e2s_v2022-01.AppImage, from here.
If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v3_6_0_rasc_v2022-01.exe, from here.
All installers are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Tools
QE for Capacitive Touch: 3.0.1
Features Added
- Added BLE Mesh support.
- Added RS-485 half duplex driver support with external transceiver.
- Added support for 2nd generation Ultra Low Power (ULP) ZMOD4xxxx Indoor Air Quality (IAQ) sensors.
- Added Cryptographic Algorithm Validation Program (CAVP) certified SCE Protected Mode module for MCUs that have SCE9.
- Added IIR Filter Accelerator (r_iirfa).
- Added XIP mode support in MCUboot.
- Added UDP support to Silex WiFi module.
- Added USBX OTG support.
- Added RFC3394 for AES 128-bit and 256-bit keys to r_sce (Protected Mode).
- Added AzureRTOS support to r_ble.
- Added MCUboot dual bank support.
- Added support for FreeRTOS Cellular Interface with a port for RYZ014A LTE Cat-M1 module.
Improvements
- Added parameter checking to GLCDC gain tables.
- Improved documentation for R_SCI_UART_BaudCalculate.
- Improved FSP Configuration tool for USB and NetX DHCP.
Third Party Software
These third party software solutions are included alongside FSP.
Amazon FreeRTOS Cellular Interface: 1.2.0
Amazon FreeRTOS Kernel: 10.4.3-LTS-Patch-2
Amazon FreeRTOS+TCP: 2.3.2-LTS-Patch-1
Arm Mbed TLS: 2.25.0+renesas.0
Arm Trusted Firmware-M: 1.3.0+renesas.0
Intel TinyCrypt: 0.2.8+renesas.0
Microsoft Azure RTOS FileX: 6.1.10
Microsoft Azure RTOS GUIX: 6.1.10
Microsoft Azure RTOS LevelX: 6.1.10
Microsoft Azure RTOS NetX Duo: 6.1.10
Microsoft Azure RTOS ThreadX: 6.1.10
Microsoft Azure RTOS USBX: 6.1.9
Bug Fixes
See fixed GitHub Issues for this release.
Known Issues
Visit GitHub Issues for this project.
Knowledge Base
Visit our knowledge base for other technical updates.
MD5 Checksums
- FSP_Packs_v3.6.0.zip 7be3d75239068e3f7b6cd13ab3b9891e
- FSP_Packs_v3.6.0.exe 731c9c02ab24789ee66a7221bdb3a7e8
- fsp_documentation_v3.6.0.zip 66c4abed84be8a03ba0b0eace166dfb5
- setup_fsp_v3_6_0_e2s_v2022-01.exe 9b0d6047fa0050c1b8c4144bbbd9e2a9
- setup_fsp_v3_6_0_e2s_v2022-01.AppImage fa569e383e683319e5616145b8d70f09
- setup_fsp_v3_6_0_rasc_v2022-01.exe 49a2bc1ed1cf96072aad5b0dabb9f582
- MDK_Device_Packs_v3.6.0.zip 0919ce5bca0f30e659881ad2e264bd6a
v3.5.0
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 3.5.0.
Download the FSP with e2 studio Windows installer for this release, setup_fsp_v3_5_0_e2s_v2021-10.exe, from here.
Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v3_5_0_e2s_v2021-10.AppImage, from here.
If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v3_5_0_rasc_v2021-10.exe, from here.
All installers are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Tools
QE for Capacitive Touch: 2.0.0
Renesas E2 and E2 Lite: 1.6.12
Features Added
- RA6T2 MCU support added.
- MCK-RA6T2 board support added.
- Trigonometric Function Unit (TFU) support added to accelerate calculation of sinf, cosf, atan2f, and hypotf on RA6T2.
- Motor 120-degree conduction control with Hall sensors support added (rm_motor_120_control_hall).
- Motor 120-degree conduction control sensorless support added (rm_motor_120_control_sensorless).
- Motor ADC and PWM modulation driver support added (rm_motor_120_driver).
- Motor control middleware updated for RA6T2.
- QSPI support added to MCUboot port (rm_mcuboot_port).
- PWM Delay Generation support added to GPT (r_gpt).
- OctaRAM support added to OSPI (r_ospi).
- SPI support added for SPI_B peripheral on RA6T2 (r_spi_b).
- SPI support added for SCI_B peripheral on RA6T2 (r_sci_b_spi).
- UART support added for SCI_B peripheral on RA6T2 (r_sci_b_uart).
- I2C master support added for SCI_B peripheral on RA6T2 (r_sci_b_i2c).
- I2C master support added for IIC_B peripheral on RA6T2 and RA2E2 (r_iic_b_master).
- I2C slave support added for IIC_B peripheral on RA6T2 and RA2E2 (r_iic_b_slave).
- ADC support added for ADC_B peripheral on RA6T2 (r_adc_b).
- New Stack tree reorganized in the RA Configuration editor.
- CTSU UART tuning feature support added.
- SCE9 TLS 1.2 support added.
- Support for multiple ZMOD sensor modules added.
Third Party Software
These third party software solutions are included alongside FSP.
Amazon FreeRTOS Kernel: 10.4.3-LTS-Patch-2
Amazon FreeRTOS+TCP: 2.3.2-LTS-Patch-1
Arm Mbed TLS: 2.25.0+renesas.0
Arm Trusted Firmware-M: 1.3.0+renesas.0
Intel TinyCrypt: 0.2.8+renesas.0
Microsoft Azure RTOS FileX: 6.1.8
Microsoft Azure RTOS GUIX: 6.1.9
Microsoft Azure RTOS LevelX: 6.1.9
Microsoft Azure RTOS NetX Duo: 6.1.9
Microsoft Azure RTOS ThreadX: 6.1.9
Microsoft Azure RTOS USBX: 6.1.9
Bug Fixes
See fixed GitHub Issues for this release.
Known Issues
Visit GitHub Issues for this project.
Knowledge Base
Visit our knowledge base for other technical updates.
MD5 Checksums
- FSP_Packs_v3.5.0.zip 1fda2d48ba530fb917f6106682a54068
- FSP_Packs_v3.5.0.exe cbbceffe230d8185b6f733e8b0f3961b
- fsp_documentation_v3.5.0.zip 6bcd64f2eaa9989d26f6136a9a761eac
- setup_fsp_v3_5_0_e2s_v2021-10.exe b13fd85808274f70b5c1a3c7556d5042
- setup_fsp_v3_5_0_e2s_v2021-10.AppImage f79579648daa9997d88c61b057bf4896
- setup_fsp_v3_5_0_rasc_v2021-10.exe fcb1ab2eec47e090ce7d924fc04d10c6
- MDK_Device_Packs_v3.5.0.zip c3218bf2474da8f6e7fbe989b016deb8
v3.4.0
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 3.4.0.
Download the FSP with e2 studio Windows installer for this release, setup_fsp_v3_4_0_e2s_v2021-10.exe, from here.
Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v3_4_0_e2s_v2021-10.AppImage, from here.
If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v3_4_0_rasc_v2021-10.exe, from here.
All installers are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Tools
GCC Compiler : 9-2020-q2-update
QE for Capacitive Touch : 2.0.0
Renesas E2 and E2 Lite: 1.6.12
Features Added
- e2 studio and RASC versions updated to 2021-10.
- RA2E2 MCU support added.
- EK-RA2E2 board support added.
- FPB-RA2E1 board support added.
- MCUboot image signing process in e2 studio improved.
- ADC window compare support added (r_adc).
- Azure RTOS USBX Peripheral Audio Class support.
- Software support for RYZ012A1/B1 Bluetooth® LE PMOD module added.
- I3C driver added.
- CTSU API for user's noise filter added.
- NIST P-256 ECDSA Signature Verification performance improved.
Third Party Software
These third party software solutions are included alongside FSP.
Amazon FreeRTOS Kernel: 10.4.3
Arm Mbed TLS: 2.25.0+renesas.0
Arm Trusted Firmware-M: 1.3.0+renesas.0
Intel TinyCrypt: 0.2.8+renesas.0
Microsoft Azure RTOS FileX: 6.1.8
Microsoft Azure RTOS GUIX: 6.1.8
Microsoft Azure RTOS LevelX: 6.1.8
Microsoft Azure RTOS NetX Duo: 6.1.8
Microsoft Azure RTOS ThreadX: 6.1.8
Microsoft Azure RTOS USBX: 6.1.8
Bug Fixes
See fixed GitHub Issues for this release.
Known Issues
Visit GitHub Issues for this project.
Knowledge Base
Visit our knowledge base for other technical updates.
MD5 Checksums
- FSP_Packs_v3.4.0.zip 98934364bdfc108d5b178d1f71f26ebf
- FSP_Packs_v3.4.0.exe 86bc711677e89da7a24bb57ac0ab0e55
- fsp_documentation_v3.4.0.zip 2ca715877905299c7e2e31d4d871fa7f
- setup_fsp_v3_4_0_e2s_v2021-10.exe bbbbfb8cc9d48a293588be4f0e78da83
- setup_fsp_v3_4_0_e2s_v2021-10.AppImage 0ec9fefecfdf88adef517887855f0da3
- setup_fsp_v3_4_0_rasc_v2021-10.exe dddeb97528524259125effefcbd7876d
- MDK_Device_Packs_v3.4.0.zip 10f5a2a6ee735adade7c19cfd95a00cc
v3.3.0
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 3.3.0.
Download the FSP with e2 studio Windows installer for this release, setup_fsp_v3_3_0_e2s_v2021-07.exe, from here.
Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v3_3_0_e2s_v2021-07.AppImage, from here.
If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v3_3_0_rasc_v2021-07.exe, from here.
All installers are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Tools
GCC Compiler : 9-2020-q2-update
QE for Capacitive Touch : 2.0.0
Renesas E2 and E2 Lite: 1.6.12
Features Added
- RA6E1 MCU support added.
- FPB-RA6E1 board support added.
- RA4E1 MCU support added.
- FPB-RA4E1 board support added.
- FS2012 flow sensor support added.
- Hardware flow control support added to UART (r_sci_uart) driver for RA4E1, RA4M2, RA4M3, RA6E1, RA6M4, and RA6M5.
- Resolution setting function added to HS300x (rm_hs300x).
- BLE privacy feature and local key management feature added to rm_ble_abs. This enables supporting ANCS (Apple Notification Center Service) and Apple Media Service(AMS).
- CTSU auto-tuning via UART function added (Using stand-alone version of QE for Capacitive Touch v2.0.0).
- CTSU dynamic touch-judgment-threshold adjustment API added.
Third Party Software
These third party software solutions are included alongside FSP.
Amazon FreeRTOS Kernel: 10.4.3
Arm Mbed TLS: 2.25.0+renesas.0
Arm Trusted Firmware-M: 1.3.0+renesas.0
Intel TinyCrypt: 0.2.8+renesas.0
Microsoft Azure RTOS FileX: 6.1.8
Microsoft Azure RTOS GUIX: 6.1.8
Microsoft Azure RTOS LevelX: 6.1.8
Microsoft Azure RTOS NetX Duo: 6.1.8
Microsoft Azure RTOS ThreadX: 6.1.8
Microsoft Azure RTOS USBX: 6.1.8
Bug Fixes
See fixed GitHub Issues for this release.
Known Issues
Visit GitHub Issues for this project.
Knowledge Base
Visit our knowledge base for other technical updates.
MD5 Checksums
- FSP_Packs_v3.3.0.zip 9b3dfb334494b1f8f8d5973b8ea102c4
- FSP_Packs_v3.3.0.exe 91a8536c4ccdee419efe5a8241001661
- fsp_documentation_v3.3.0.zip 8831c873364605e608d9b1e7af9de3ff
- setup_fsp_v3_3_0_e2s_v2021-07.exe 20e5d386e835c340a368bdc518d61232
- setup_fsp_v3_3_0_e2s_v2021-07.AppImage 8cf875fe80094003d556771d70a3e5b5
- setup_fsp_v3_3_0_rasc_v2021-07.exe ded8da47fe64f25d3b5c91b9416443ef
- MDK_Device_Packs_v3.3.0.zip 8e59155320f13dc71493931757b00a3e
v3.2.1
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 3.2.1.
This release includes packs that are installed separately from e2 studio. This means the v3.2.0 platform installer (Windows) or the v3.2.0 AppImage (Linux) should be installed first. Then the packs for this release can be installed into the new e2 studio.
The packs, and a standalone pack installer, are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Bug Fixes
See fixed GitHub Issues for this release.
Knowledge Base
Visit our knowledge base for other technical updates.
MD5 Checksums
- FSP_Packs_v3.2.1.zip fb9a342ee4fcbbfa115125e55682b513
- FSP_Packs_v3.2.1.exe d20a67efdd50bcebcfc23062fb629518
- fsp_documentation_v3.2.1.zip 836d629341adca2174c004b631bb0089
- MDK_Device_Packs_v3.2.1.zip 43652529991ef2ba5991be62eaad4cd4
v3.2.0
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 3.2.0.
Download the FSP with e2 studio Windows installer for this release, setup_fsp_v3_2_0_e2s_v2021-07.exe, from here.
Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v3_2_0_e2s_v2021-07.AppImage, from here.
If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v3_2_0_rasc_v2021-07.exe, from here.
All installers are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Tools
GCC Compiler : 9-2020-q2-update
QE for Capacitive Touch : 1.3.0
Features Added
- MCUboot port for SCE9 protected mode added.
- Azure NetX Duo port for Silex WiFi module added.
- Azure IoT Middleware for Azure RTOS support added.
- Azure RTOS USBX PHID support added.
- Azure RTOS USBX HHID support added.
- Azure NetX Crypto AES hardware acceleration added for MCUs with SCE7: RA6M1, RA6M2, RA6M3, and RA6T1.
- USB HMSC (FreeRTOS+FAT) on bare metal support added.
- Support for smaller memory footprint configuration (Balance, Compact) added to BLE stack.
- Audio playback using PWM module added. This module plays raw unsigned PCM data that fits in the PWM period.
- ADPCM decoder added.
- FIFO support added to CAN driver (r_can).
- Support for additional bit widths added to r_spi driver - now supports 8-16, 20, 24, and 32-bit transfers.
- Linux AppImage now available for e2 studio.
Third Party Software
These third party software solutions are included alongside FSP.
Microsoft Azure RTOS ThreadX: 6.1.8
Microsoft Azure RTOS NetX Duo: 6.1.8
Microsoft Azure RTOS FileX: 6.1.8
Microsoft Azure RTOS USBX: 6.1.7
Microsoft Azure RTOS GUIX: 6.1.8
Microsoft Azure RTOS LevelX: 6.1.8
Arm Mbed TLS: 2.25.0+renesas.0
Arm Trusted Firmware-M: 1.3.0+renesas.0
Renesas E2 and E2 Lite: 1.5.3+20201217
Intel TinyCrypt: 0.2.8+renesas.0
Bug Fixes
See fixed GitHub Issues for this release.
Known Issues
Visit GitHub Issues for this project.
Knowledge Base
Visit our knowledge base for other technical updates.
MD5 Checksums
- FSP_Packs_v3.2.0.zip 6a519de4f654a70c06f73feda37dc7f3
- FSP_Packs_v3.2.0.exe 9d62157242b893a942a42f391770f6c8
- fsp_documentation_v3.2.0.zip 332a16c4df1ffff301e1590a2cde1205
- setup_fsp_v3_2_0_e2s_v2021-07.exe 522c5f0d448dabfcc600becf76a8b2c9
- setup_fsp_v3_2_0_e2s_v2021-07.AppImage f4696ba2c51c89537303a10df769ade1
- setup_fsp_v3_2_0_rasc_v2021-07.exe 48ee8810c9e22a2f2d9f6ec22f18ab94
- MDK_Device_Packs_v3.2.0.zip 7b59466103a1a24732946d8c4b9858cf