Releases: renesas/fsp
v3.1.0
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 3.1.0.
Download the FSP with e2 studio Installer for this release, setup_fsp_v3_1_0_e2s_v2021-04.exe, from here.
If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v3_1_0_rasc_v2021-04.exe, from here.
All installers are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Tools
GCC Compiler : 9-2020-q2-update
QE for Capacitive Touch : 1.3.0
Features Added
- Sensor modules added for:
- HS300X (Temperature/Humidity Sensor)
- ZMOD4410/4510 (Gas Sensor)
- Communications interface implemented on I2C.
- Motor control middleware added:
- Motor encoder position control
- Motor encoder speed control
- Motor encoder angle control
- CEC driver added.
- Azure RTOS LevelX support added.
- Azure RTOS USBX PMSC support added.
- Azure RTOS USBX HMSC support added.
- Azure RTOS USBX HMSC integration with Azure RTOS FileX added.
- Azure RTOS GUIX screen rotation support added.
- TinyCrypt integration added, including hardware acceleration on RA2 devices.
- MCUboot integration with TinyCrypt added.
- exFAT support added to Azure RTOS FileX I/O Driver.
- Added new EULA with licensing terms of MCU and Sensor software.
Third Party Software
These third party software solutions are included alongside FSP.
Microsoft Azure RTOS ThreadX: 6.1.7
Microsoft Azure RTOS NetX Duo: 6.1.7
Microsoft Azure RTOS FileX: 6.1.7
Microsoft Azure RTOS USBX: 6.1.7
Microsoft Azure RTOS GUIX: 6.1.7
Microsoft Azure RTOS LevelX: 6.1.7
Arm Mbed TLS: 2.24.0+renesas.0
Arm Trusted Firmware-M: 1.2.0+renesas.0
Renesas E2 and E2 Lite: 1.5.3+20201217
Intel TinyCrypt: 0.2.8+renesas.0
Bug Fixes
See fixed GitHub Issues for this release.
Known Issues
Visit GitHub Issues for this project.
Knowledge Base
Visit our knowledge base for other technical updates.
MD5 Checksums
- FSP_Packs_v3.1.0.zip cc4e0c922174b6087c91260f11c071e5
- FSP_Packs_v3.1.0.exe c5114d7d8e2353797da9c6c3a6288557
- fsp_documentation_v3.1.0.zip f2a3f0696367f79cf57bc6f098c59893
- setup_fsp_v3_1_0_e2s_v2021-04.exe 832a8f5558c96e12978b388815dd4ca2
- setup_fsp_v3_1_0_rasc_v2021-04.exe 74a74deb2c298181e70dd3a4281d5cbf
- MDK_Device_Packs_v3.1.0.zip b4bde6a52d57e5afdcdef85210e40c97
v3.0.1
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 3.0.1.
This release includes packs that are installed separately from e2 studio. This means the v3.0.0 platform installer should be installed first. Then the packs for this release can be installed into the new e2 studio.
The packs, and a standalone pack installer, are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Bug Fixes
See fixed GitHub Issues for this release.
Knowledge Base
Visit our knowledge base for other technical updates.
MD5 Checksums
- FSP_Packs_v3.0.1.zip 4cd1754809d975692184edaa92dd43b9
- FSP_Packs_v3.0.1.exe b1382859df469a317559eda1cb37ba7c
- fsp_documentation_v3.0.1.zip 0031dcf5ddb7c14a7833f263ff280375
- MDK_Device_Packs_v3.0.1.zip 3899efc33348bdfc28cc60e6478ae677
v3.0.0
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 3.0.0.
Download the FSP with e2 studio Installer for this release, setup_fsp_v3_0_0_e2s_v2021-04.exe, from here.
If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v3_0_0_rasc_v2021-04.exe, from here.
All installers are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Project Migration
This major release includes breaking changes.
See project migration GitHub Issues for migrating from v2.x to v3.x.
Tools
GCC Compiler : 9-2020-q2-update
QE for Capacitive Touch : 1.3.0
Features Added
- Microsoft Azure RTOS ThreadX support added, including support for Azure RTOS TraceX.
- Microsoft Azure RTOS NetX Duo support added. Ethernet port available.
- Microsoft Azure NetX Duo add-ons are supported through XMLs and Developer Assistance, including:
- Auto IP
- BSD
- DHCP IPv4 Server & Client
- DHCP IPv6 Server & Client
- DNS Client
- FTP Server & Client
- HTTP Server & Client
- MQTT Client
- NAT
- SMTP Client
- SNMP Agent
- SNTP Client
- TFTP Server & Client
- Telnet Server & Client
- Web HTTP Server & Client
- Microsoft Azure RTOS NetX Secure TLS support added. The following functions are hardware accelerated on Cortex-M33 MCUs:
- RSA 2K signature generation and verification
- RSA 3K/4K signature verification
- AES
- TRNG
- SHA224/256
- ECC (ECDSA and ECDH for P-224, 256 and 384 curves)
- Microsoft Azure RTOS FileX support added. Ports available for SD, eMMC, QSPI, and OSPI.
- Microsoft Azure RTOS USBX PCDC and HCDC support added.
- Microsoft Azure RTOS GUIX support added. Hardware acceleration available on RA6M3 for GLCDC, D/AVE 2D drawing engine, and JPEG.
- MCUboot bootloader support added.
- PTP driver added to support Ethernet PTP Controller (EPTPC) peripheral on RA6M3.
- Bank swap support added to the flash driver for RA6M4 and RA6M5.
- SCE9 Protected Mode crypto operation support added for RA4M2, RA4M3, RA6M4, and RA6M5 MCUs with the following features:
- True random number generation
- SHA-256 hashing algorithm
- AES 128 and 256 bit operations for ECB, CBC, CCM and GCM chaining modes
- ECDSA and ECDH operations for 192, 224, 256 and 384 bit ECC NIST curves
- RSA 1024/2048 bit PKCS1-V1.5 signature generation and 1024/2048/3072/4096 bit signature verification operations
- HMAC-SHA256 and AES-CMAC 128/256 bit message authentication codes
- OSPI support added for block media port.
- Full text search added to user manual.
Third Party Software
These third party software solutions are included alongside FSP.
Microsoft Azure RTOS ThreadX: 6.1.6
Microsoft Azure RTOS NetX Duo: 6.1.6
Microsoft Azure RTOS FileX: 6.1.6
Microsoft Azure RTOS USBX: 6.1.6
Microsoft Azure RTOS GUIX: 6.1.6
Arm Mbed TLS: 2.24.0+renesas.0
Arm Trusted Firmware-M: 1.2.0+renesas.0
Renesas E2 and E2 Lite: 1.5.3+20201217
Bug Fixes
See fixed GitHub Issues for this release.
Known Issues
Visit GitHub Issues for this project.
Knowledge Base
Visit our knowledge base for other technical updates.
MD5 Checksums
- FSP_Packs_v3.0.0.zip 0793596986951a3732e8c7897b9c7db4
- FSP_Packs_v3.0.0.exe aba504b200c98463ea7d394ab7e87239
- fsp_documentation_v3.0.0.zip a35400da8ff7e7abcefc688e6ad7849b
- setup_fsp_v3_0_0_e2s_v2021-04.exe 1c32eddc5cd374ef9ea2c78dd79314f8
- setup_fsp_v3_0_0_rasc_v2021-04.exe 164690ff0a79f1ccb436206e3b12cd5e
- MDK_Device_Packs_v3.0.0.zip 3f912dcae0310b337624af6eabb26673
v2.4.0
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 2.4.0.
Download the FSP with e2 studio Installer for this release, setup_fsp_v2_4_0_e2s_v2021-01.exe, from here.
If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v2_4_0_rasc_v2021-01.exe, from here.
All installers are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Tools
GCC Compiler : 9-2020-q2-update
QE for Capacitive Touch : 1.2.0
Features Added
- RA6M5 MCU support added.
- EK-RA6M5 Board support added.
- CAN-FD driver added to support new CAN-FD peripheral on RA6M5.
- Block Media SPI module added which allows FreeRTOS+FAT to work on QSPI and other SPI Flash Instances other than OSPI. OSPI support will be added in a future release.
- The FreeRTOS port now uses PSPLIM on CM33 MCUs to detect stack overflow.
- Exposed SNTP functionality of the Silex WiFi Module to allow for local and epoch time acquisition.
- Repeat Block transfer mode of DMAC is now supported with ADC Ring Buffer through new ADC-DMAC module on RA6M4, RA6M5, RA4M3, and RA4M2 MCUs.
- Added support to use HW acceleration for CMAC and AES CCM (128, 192 and 256-bit keys) on RA6M5, RA6M4, RA4M3 and RA4M2 MCUs.
- Added support to use HW acceleration for HMAC (SHA224 and SHA256) on RA6M5, RA6M4, RA4M3 and RA4M2 MCUs.
Third Party Software
These third party software solutions are included alongside FSP.
Arm Mbed Crypto: 3.1.0+renesas.2
Arm Trusted Firmware-M: 1.1.0+renesas.1
Renesas E2 and E2 Lite: 1.5.3+20201217
Bug Fixes
See fixed GitHub Issues for this release.
Known Issues
Visit GitHub Issues for this project.
Knowledge Base
Visit our knowledge base for other technical updates.
MD5 Checksums
- FSP_Packs_v2.4.0.zip bb35b6819dad0de30711bd75894639f9
- FSP_Packs_v2.4.0.exe c0314d1c4f39ac0c9fdb26ce3f4102e9
- fsp_documentation_v2.4.0.zip b04b0523d06370bff3213b2dc855bb61
- setup_fsp_v2_4_0_e2s_v2021-01.exe 29246fef36d5d15635b49f91476053de
- setup_fsp_v2_4_0_rasc_v2021-01.exe e48802b5f98049406af57293b0d97d72
- MDK_Device_Packs_v2.4.0.zip 6579b715d956a5791a4ab30ab9f8b5df
v2.3.0
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 2.3.0.
Download the FSP with e2 studio Installer for this release, setup_fsp_v2_3_0_e2s_v2021-01.exe, from here.
If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v2_3_0_rasc_v2021-01.exe, from here.
All installers are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Tools
GCC Compiler : 9-2019-q4-major
QE for Capacitive Touch : 1.2.0
Features Added
- RA2E1 MCU support added.
- EK-RA2E1 Board support added.
- RA4M2 MCU support added.
- EK-RA4M2 Board support added.
- Added support to use HW acceleration for CMAC and AES CCM (128, 192 and 256bit keys) on RA6M4, RA4M3, and RA4M2 MCUs.
- Added support to use HW acceleration for HMAC (SHA224 and SHA256) on RA6M4, RA4M3, and RA4M2 MCUs.
- Added support to utilize Crypto HW acceleration for AES-GCM and GHASH to process the initialization vector on RA6M4, RA4M3, and RA4M2 MCUs.
- C-Cache is now enabled by default for RA4M2, RA4M3 and RA6M4 MCUs.
- Developer assistance now works for non-secure callable modules in a non-secure project.
- The r_ether driver now supports configuring padding bytes in receive buffers.
- CM33 devices no longer allocate space for ROM registers between the vector table and 0x500. This space was unused since the new parts do not have ROM registers at 0x400.
- Added support for Internal Clock Supply Architecture Type B for RA2L1 and RA2E1 MCUs.
- Blinky templates are no longer shown when creating projects and choosing Custom User Board. These projects would not build because no LEDs were defined.
Third Party Software
These third party software solutions are included alongside FSP.
Arm Mbed Crypto: 3.1.0+renesas.2
Arm Trusted Firmware-M: 1.1.0+renesas.1
Renesas E2 and E2 Lite: 1.5.3+20201217
Bug Fixes
A critical bug was found related to internal flash operation on prior FSP v2.x releases that may impact existing projects. Information about this issue can be found here. This bug has been fixed in this release.
See fixed GitHub Issues for this release.
Known Issues
Visit GitHub Issues for this project.
Knowledge Base
Visit our knowledge base for other technical updates.
MD5 Checksums
- FSP_Packs_v2.3.0.zip 28d080fb253d3184174532d931d28213
- FSP_Packs_v2.3.0.exe 5c137c53ab8189086747a86661e8eff8
- fsp_documentation_v2.3.0.zip cf408d04c3647d36431bf1fe5e66bc18
- setup_fsp_v2_3_0_e2s_v2021-01.exe 77bf1c61cde4803535d8f7309c4ac4c5
- setup_fsp_v2_3_0_rasc_v2021-01.exe 320963d110cea15f1454c4376cd94f04
- MDK_Device_Packs_v2.3.0.zip e37f2698e8a2dff791aad34a16b20d9a
v2.2.1
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 2.2.1.
This release includes packs that are installed separately from e2 studio. This means the v2.2.0 platform installer should be installed first. Then the packs for this release can be installed into the new e2 studio.
The packs, and a standalone pack installer, are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Bug Fixes
See fixed GitHub Issues for this release.
Knowledge Base
Visit our knowledge base for other technical updates.
MD5 Checksums
- FSP_Packs_v2.2.1.zip ddb785c7a975659b3405e1e34a337e0d
- FSP_Packs_v2.2.1.exe fe9a6cc1fbec0aff52d870105e2ef292
- fsp_documentation_v2.2.1.zip ac7be234259557f2f3fb92a14e89bb53
v2.0.3
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 2.0.3.
This release includes packs that are installed separately from e2 studio. This means the v2.0.0 platform installer should be installed first. Then the packs for this release can be installed into the new e2 studio.
The packs, and a standalone pack installer, are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Bug Fixes
See fixed GitHub Issues for this release.
Knowledge Base
Visit our knowledge base for other technical updates.
MD5 Checksums
- FSP_Packs_v2.0.3.zip 19c14f003e96130a0c2e5a493ec43988
- FSP_Packs_v2.0.3.exe 594840f3776106be66013201ea1e0b68
- fsp_documentation_v2.0.3.zip 778cff4c17751f70c5f0567cb06a462d
v2.2.0
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 2.2.0.
Download the FSP with e2 studio Installer for this release, setup_fsp_v2_2_0_e2s_v2020-10.exe, from here.
If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v2_2_0_rasc_v2020-11.exe, from here.
All installers are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Tools
GCC Compiler : 9-2019-q4-major
QE for Capacitive Touch : 1.2.0
Features Added
- RA2L1 MCU support added.
- EK-RA2L1 Board support added.
- RSSK-RA2L1 Board support added.
- RA2L1 MCUs can choose LDO or DCDC voltage regulator through new R_BSP_PowerModeSet() function.
- RA4M3 MCU support added.
- EK-RA4M3 Board support added.
- Implemented Arm TrustZone stack sealing. More info here.
- Hardware crypto acceleration support for AES192 (ECB, CBC, CTR, GCM chaining modes); ECC256 and ECC384 Brainpool curves are now available on RA6M4 and RA4M3.
- USB host and peripheral vendor class support added.
- LittleFS now has thread safe option.
- RM_FREERTOS_PLUS_FAT_MediaInit() now accepts rm_freertos_plus_fat_device_t structure in rm_freertos_plus_fat_disk_cfg_t to provide sector information. Duplicate structure data members have been deprecated.
Third Party Software
These third party software solutions are included alongside FSP.
Arm Mbed Crypto: 3.1.0+renesas.2
Arm Trusted Firmware-M: 1.1.0+renesas.1
Bug Fixes
Arm has disclosed a potential Armv8-M processor Secure software Stack Sealing vulnerability on 16th October 2020. This issue can be tracked here.
See fixed GitHub Issues for this release.
This release also includes bug fixes from releases v2.0.2 and v2.1.1.
See fixed GitHub Issues for v2.0.2.
See fixed GitHub Issues for v2.1.1.
Known Issues
Visit GitHub Issues for this project.
Knowledge Base
Visit our knowledge base for other technical updates.
MD5 Checksums
- FSP_Packs_v2.2.0.zip a8f963d8db89e0459032a7a4ce0a6411
- FSP_Packs_v2.2.0.exe 0bc857d2fbf24dff3a1d93840f94d03a
- fsp_documentation_v2.2.0.zip f90fe5d14700d7dbfa5a2ae8aa330b67
- setup_fsp_v2_2_0_e2s_v2020-10.exe ed2c95650d7b1d8d042d5b9158dff140
- setup_fsp_v2_2_0_rasc_v2020-11.exe 0315aad97e6e4b1e8dd15247a4f8d125
- MDK_Device_Packs_v2.2.0.zip 9335b9146b0f025d315d78c8b9001594
v2.0.2
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 2.0.2.
This release includes packs that are installed separately from e2 studio. This means the v2.0.0 platform installer should be installed first. Then the packs for this release can be installed into the new e2 studio.
The packs, and a standalone pack installer, are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Bug Fixes
See fixed GitHub Issues for this release.
Knowledge Base
Visit our knowledge base for other technical updates.
MD5 Checksums
- FSP_Packs_v2.0.2.zip 66d8e6fd51aae9b32ec57467b2087ae6
- FSP_Packs_v2.0.2.exe 590c3773e0c2de2417f0d9c2da7be949
- fsp_documentation_v2.0.2.zip bc9cba5176f316d56c05868858e3dc40
v2.0.1
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 2.0.1.
This release includes packs that are installed separately from e2 studio. This means the v2.0.0 platform installer should be installed first. Then the packs for this release can be installed into the new e2 studio.
The packs, and a standalone pack installer, are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Bug Fixes
- The TF-M module used a hardcoded value as its seed. BL2 now generates a new seed on each reboot and saves it to the shared secure RAM. TF-M was updated to use the shared seed from BL2.
- The TF-M module used a hardcoded array as its device unique key, It has been updated to use the device unique ID instead. Key derivation is performed using the unique ID and user provided label.
Knowledge Base
Visit our knowledge base for other technical updates.
MD5 Checksums
- FSP_Packs_v2.0.1.zip c7dc7cd51ec1d0289296cafc2886b0c7
- FSP_Packs_v2.0.1.exe a32ac67ff203b603ef7454852240e6e8
- fsp_documentation_v2.0.1.zip 3111744f2c26abe5dc94fe11bbcf7134