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IAR Compiler: 8.50.7

QE for Capacitive Touch : 1.2.0

QE for BLE : 1.1.0

e2 studio: 2020-10

RASC: 2020-11

Features Added

RA6T1 MCU support added.
RSSK-RA6T1 Board support added.
Motor control middleware added:
- rm_motor_current
- rm_motor_driver
- rm_motor_estimate
- rm_motor_sensorless
- rm_motor_speed
Added support for using AWS HTTPS Client in FSP projects.
USB composite support added:
- PMSC + PCDC
- PCDC + PHID
- PMSC + PHID
- PCDC + PCDC
New BSP API has been added to change OctaSPI Clock at run time. Added fix to clear dummy cycle register when switching from OPI to SPI mode.
More hardware acceleration added to mbed-crypto:
- Added support for AES GCM for 128 and 256 bit keys
- Added ECDH support
Renesas Advanced Smart Configurator (RASC) added tooling support for RA6M4 Arm® TrustZone® for Keil MDK tool and IAR Embedded Workbench.

Third Party Software

These third party software solutions are included alongside FSP.

FreeRTOS: 202007.00

Arm Mbed Crypto: 3.1.0+renesas.2

Arm Trusted Firmware-M: 1.1.0+renesas.1

SEGGER emWin: 6.14g

SEGGER J-Link: 6.86d

Visit our knowledge base for other technical updates.

Bug Fixes

R_BLE_L2CAP_RegisterCfPsm() API would get stuck in an infinite loop when registering L2CAP callback function.
Disable the use of WiFi API functions WIFI_Scan(), WIFI_Ping(), SOCKETS_GetHostByName(), WIFI_GetMAC(), and WIFI_GetIP() during an active socket connection when using one UART. All open sockets must be closed before these functions are called.
Fixed an issue causing LittleFS configuration properties to be applied incorrectly.
Exporting a wrapped persistent AES256 key and then re-importing it after destroying the key handle for AES GCM usage did not work.
Updated WiFi scan results parser to handle large number of access points without the WIFI_Scan() call returning a failure.
Added option in Virtual EEPROM to configure the physical start address. Projects currently using a non-default start address will need to update the RA Configuration editor for the rm_vee_flash module, and re-generate their project content.
SSI would generate two TX_EMPTY callbacks per write. Now it generates only one.

Known Issues

Issue
Due to the changes in Linker SCAT file format in FSP 2.x, please ensure that a Keil MDK pack version 2.x is used with FSP 2.x. Failure to do so will cause linker errors. For existing projects based on FSP 1.x please continue to use Keil MDK pack 1.x
Issue
Renesas Advanced Smart Configurator (RASC) for IAR EWARM and Keil MDK work flow has been changed in the 2020-11 version onwards. Refer to the RASC quick start guide attached to this release for the details.
Issue
When debugging a Non Secure project in IAR EWARM, it is necessary to force a hardware reset to pick up the correct reset vector. This can be done by adding the following to the Options | Debugger | Extra Options dialog in EWARM: --drv_vector_table_base=0x0
Issue
When debugging a "flat" (non-TrustZone) project in IAR EWARM with a device that supports TrustZone, the device partition sizes are always reported as needing to be updated. This can be worked around by unchecking the "Use macro file(s)" check box in the Options | Debugger | Setup dialog in EWARM and setting device partition sizes manually (if required) with the Renesas Device Partition Manager.
Issue
When building TrustZone secure projects with the IAR compiler using -O1 (Low) optimization, there is a linker error from bsp_security.c.
Workaround
Build with -Oh (High, Balanced) optimization. Select the project or the file bsp_security.c and select "High" and "Balanced" from Options | C/C++ Compiler | Optimizations. Check "Override inherited settings" to change the setting for bsp_security.c only.
Issue
mbedTLS can run on RA6M4 using software crypto only.
Issue
USB_VBUS pin (P4_07) is not available to configure through the pin configurator for the RA4W1.
Workaround
Use the R_IOPORT_PinCfg() function to configure the USB_VBUS pin (P4_07).
Issue
Mbed Crypto is currently not thread safe when being used standalone (ie: as top of stack) in a FreeRTOS project.
Workaround
The user should add a mutex around calls to Mbed Crypto.
Issue
In some cases GCC is removing debug information for functions in a Secure project. This is being actively investigated.
Issue
When creating services for a custom profile in the R_BLE Custom Profile RA (QE) View, if you create multiple services with the same UUID or the same abbreviation, the GUI may behave incorrectly.
Workaround
Do not use duplicate UUIDs or abbreviation.
Issue
USB driver jumps to the default hander when closing either USB IP0 or USB IP1 module by calling R_USB_Close function while HMSC and PCDC are working.
Issue
The USB driver does not work properly when the USB interrupt priority level is higher priority than the configMAX_SYSCALL_INTERRUPT_PRIORITY macro value.
Workaround
Specify a lower priority for the USB interrupt priority than the configMAX_SYSCALL_INTERRUPT_PRIORITY macro value.
Issue
In the write completion event of PCDC + PCDC composite class, "USB_CLASS_PCDC2" is not set to the member "type" of "usb_event_info" structure.
Workaround
Please use the member "pipe" in "usb_event_info" structure to determine the PCDC channel number after the write event is completed in PCDC + PCDC.
Issue
An error is output when selecting DMA feature in RA configuration of USB composite class. Please ignore this error.
Issue
Dividers >= 20 for Bus Timing > QSPKCLK Divisor are off by 1.
Workaround
When selecting a divider >= 20 for Bus Timing > QSPKCLK Divisor, select the next available smaller divider. Do not select the maximum divider of 48.

Knowledge Base

MD5 Checksums

FSP_Packs_v2.1.0.zip dd2f3366bff68fcbad0c2add3a6bf035
FSP_Packs_v2.1.0.exe b40ff9df82a35ba77b087afc85df04bf
fsp_documentation_v2.1.0.zip dd0e13ea93a84249e63e5ec8dc326398
setup_fsp_v2_1_0_e2s_v2020-10.exe 4f3c83f3ab5b767e7aa805b11225a075
setup_fsp_v2_1_0_rasc_v2020-11.exe 2f987d6a46269e9c7306358ee30dd41d
MDK_Device_Packs_v2.1.0.zip 88e3d2a6393777d0302f8219f3995375
rasc_quick_start_fsp_v2_1_0_rasc_v2020-11.zip d2118374b488025d8c48b89fb71dd963

Assets 9

06 Oct 01:12

renesas-fsp-development

v2.0.0

560904f

v2.0.0

Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 2.0.0.

Download the FSP with e2 studio Installer for this release, setup_fsp_v2_0_0_e2s_v2020-10.exe, from here.

If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v2_0_0_rasc_v2020-10.exe, from here.

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

QE for Capacitive Touch : 1.2.0

QE for BLE : 1.1.0

e2 studio: 2020-10

Features Added

RA6M4 MCU with Arm® TrustZone® support. Users can now create Secure, Non-Secure, and Flat projects.
EK-RA6M4 board support.
Many FSP modules now have Guard functions to aid with Arm® TrustZone® development. Refer to the Configuration section in the FSP user manual for each module to see if the module supports Guard functions.
Added hardware crypto support to access enhanced Secure Crypto Engine (SCE) peripheral on RA6M4 MCU.
New Renesas pin configurator for RA6M4.
Updated FreeRTOS port to support calling into Secure area from Non-secure task.
OSPI driver, r_ospi, is now available.
PLL2 support added to r_cgc.
Updated Amazon FreeRTOS to version 202007.00.
Added the ability to remove Secure Sockets TLS Support stack element from a Secure Sockets on WiFi element in an e2 studio project. With TLS removed the memory requirements for an e2 studio WiFi project is greatly reduced.
Touch pad support added to rm_touch module.
FreeRTOS+TCP macro ipconfigIGNORE_UNKNOWN_PACKETS is now configurable in the RA configurator.
The correction calculation accuracy of CTSU1 is improved to reduce the variation of measured values for each chip.
BLE on RA4W1 can now be used in a multithreaded environment.

Third Party Software

These third party software solutions are included alongside FSP.

FreeRTOS: 202007.00

Arm Mbed Crypto: 3.1.0+renesas.2

Arm Trusted Firmware-M: 1.1.0+renesas.1

SEGGER emWin: 6.14d

SEGGER J-Link: 6.86

Visit our knowledge base for other technical updates.

Bug Fixes

Added a property to r_ether_phy module in e2 studio for configuring mii_type.
Fixed USB HHID and HCDC issues where bare metal version would not work in FSP v1.3.0.
Fixed fault that would occur during enumeration of PHID in FSP v1.3.0.
Fixed fault that would occur when calling R_USB_EventGet() in bare metal projects for FSP v1.3.0.
In the FreeRTOS General properties, the default value of Assert has been changed to "if (!(x)) { __BKPT(0); }". This new implementation reduces code size because it does not store strings for the file, line, and function in the binary.
MBEDTLS_PLATFORM_MEMORY, MBEDTLS_THREADING_ALT and MBEDTLS_THREADING_C are now enabled by default.
Projects built with the Arm Compiler 6 toolchain reserved extra flash memory for uninitialized RAM sections such as .fsp_dtc_vector_table, .stack, and .noinit. These sections have been renamed to start with ".bss." to fix this.
Removed board configuration macros from "board.h". The correct default macros are generated by the configurator for each board.
Resolved issue with JPEG when used in emWin with parameter checking enabled and the "Input Alignment" option set to "Unaligned (slower)"; existing projects may need to ensure EMWIN_JPEG_NUMBYTES_INBUFFER is set to 0xFFFFFFF8.
When a duty cycle of (period - 1) was requested for the GPT in PWM mode (saw wave), it would output a 100% duty cycle.
USB PMSC driver now properly handles locked SD cards.
Removed duplicate SSI TX_EMPTY callback.

Known Issues

Issue
Renesas Advanced Smart Configurator (RASC) for IAR EWARM and Keil MDK tools does not support the RA6M4 Arm® TrustZone® feature in this version. This is expected in the next release.
Issue
Exporting a wrapped persistent AES256 key and then re-importing it after destroying the key handle for AES GCM usage will not work.
Issue
Due to the changes in Linker SCAT file format in FSP 2.x, please ensure that a Keil MDK pack version 2.x is used with FSP 2.x. Failure to do so will cause linker errors. For existing projects based on FSP 1.x please continue to use Keil MDK pack 1.x
Issue
USB_VBUS pin (P4_07) is not available to configure through the pin configurator for the RA4W1.
Workaround
Use the R_IOPORT_PinCfg() function to configure the USB_VBUS pin (P4_07).
Issue
When a large number of WiFi access points are available for scan the WIFI_Scan() function can fail due to the RX CMD Port buffer size being insufficient.
Workaround
To avoid WiFi scan failures in an environment with many access points the user must increase the size of the RX CMD Port buffer in the configurator.
Issue
Mbed Crypto is currently not thread safe when being used standalone (ie: as top of stack) in a FreeRTOS project.
Workaround
The user should add a mutex around calls to Mbed Crypto.
Issue
In some cases GCC is removing debug information for functions in a Secure project. This is being actively investigated.
Issue
When creating services for a custom profile in the R_BLE Custom Profile RA (QE) View, if you create multiple services with the same UUID or the same abbreviation, the GUI may behave incorrectly.
Workaround
Do not use duplicate UUIDs or abbreviation.
Issue
R_BLE_L2CAP_RegisterCfPsm() API gets stuck in an infinite loop when registering L2CAP callback function.
Issue
If parameter checking is enabled, R_CGC_ClocksCfg() returns an error when a project is migrated from 1.x to 2.x.
Workaround
The new field cgc_clocks_cfg_t::pll2_state must be initialized to CGC_CLOCK_CHANGE_NONE to avoid a parameter checking error.

Knowledge Base

MD5 Checksums

FSP_Packs_v2.0.0.zip 16952bce908c83bd47b490adcab11229
FSP_Packs_v2.0.0.exe 43dec9cb5105c1d5fa367eae42076096
fsp_documentation_v2.0.0.zip 98cdb2564b634e7c5ce3d13d470f3b9a
setup_fsp_v2_0_0_e2s_v2020-10.exe 39bbfa68b369144897313c3aa010e929
setup_fsp_v2_0_0_rasc_v2020-10.exe 5f02a5cf138f8cff9ec64eb608670c7e
MDK_Device_Packs_v2.0.0.zip fb9b9d65e245926932eeb91531e0637c

Assets 8

18 Sep 15:26

renesas-fsp-development

v1.3.1

a678257

v1.3.1

Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 1.3.1.

This release includes packs that are installed separately from e2 studio. This means the v1.3.0 platform installer should be installed first. Then the packs for this release can be installed into the new e2 studio.

The packs, and a standalone pack installer, are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Bug Fixes

Fixed fault that would occur when calling R_USB_EventGet() in bare metal projects for FSP v1.3.0.
Fixed fault that would occur during enumeration of PHID in FSP v1.3.0.
Fixed RAM corruption issue in R_USB_Open() in USB Host driver.

MD5 Checksums

FSP_Packs_v1.3.1.zip ba698b55388b8bddd638d9860b970187
FSP_Packs_v1.3.1.exe 52f1465d2cdfa8face05a99662ca409d
fsp_documentation_v1.3.1.zip 4078934efd3a3f7b92ab9a890b75d92b

Assets 5

21 Aug 17:08

renesas-fsp-development

v1.3.0

15b2501

v1.3.0

Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 1.3.0.

Download the FSP with e2 studio Installer for this release, setup_fsp_v1_3_0_e2s_v2020-07.exe, from here.

If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v1_3_0_rasc_v2020-07.exe, from here.

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

QE for Capacitive Touch : 1.1.0

QE for BLE : 1.0.0 *Refer to Known Issues section if using this tool

e2 studio: v2020-07

Features Added

Virtal EEPROM module added
R_ADC_InfoGet() now supports reading TSN calibration data for RA6 devices
USB HMSC and PCDC can now be used at the same time on different USB ports on the RA6M3

Third Party Software

These third party software solutions are included alongside FSP.

SEGGER emWin: 6.14a

SEGGER J-Link: 6.82a

Bug Fixes

Removed board configuration macros from "board.h". The correct default macros are generated by the configurator for each board.
AC6 linker scripts now have RAM end address and will report an error when RAM is overflowed.
Fixed incorrect values (larger by 1) getting set in bit_timing_cfg for r_can in e2 studio. These include time segments 1 and 2 and synchronization jump width.
Fixed build warnings in generated code for GPT, ADC, and OPAMP.
When long file name (LFN) and Unicode UTF16 Support in FreeRTOS + FAT configuration is enabled a build error was thrown by the compiler.
Fixed a memory leak issue in BLE library when closing module.
The semaphore timeout for the Silex WiFi module is now properly exported from the e2 studio configurator.
When SPI slave mode is used it was possible to choose a slave select other than SS0 in RA configurator. The only valid option is SS0 and that is now checked.
Building a project in IAR Embedded Workbench with RASC would fail due to duplicate definition error for R_BSP_WarmStart().
The minimum allowed FCLK frequency for Flash LP use was hard coded as 4MHz when some parts supported 1MHz.
Fixed an issue with unexpected interrupts on multi-master IIC buses.
ADC16 internal reference on RA2A1 was not disabled by calling R_ADC_Close().
GLCDC pins are no longer configured by default on the EK-RA6M3.
Fixed a typo in a GPT GTETRGD configuration option.
The generated code for r_ether did not have externs for the configuration and control structures.
The Flash HP module in the RA Configurator did not check for the callback being NULL when BGO was enabled.
CRC seed value was not set correctly for 8 or 16 bit values.
In FreeRTOS *FromISR() APIs, interrupt priority levels (IPLs) were not checked for interrupt numbers less than 16, and validation always failed for interrupt numbers greater than 16. Now all IPLs are checked to ensure they cannot interrupt the scheduler.
BSP clock frequency macros for MOCO, LOCO and SUBCLOCK are now exposed.
Fixed a parameter checking issue in FLASH_HP when erasing a portion of the first 8 blocks of code flash.
RA4W1 projects with Custom User Board chosen could not be created in e2 studio.

Known Issues

Issue
The QE for BLE tool v1.0.0 does not support e2 studio version 2020-04 or newer. The platform installer for this release will install e2 studio 2020-07.
Workaround
Applications that need to use the QE for BLE tool must use e2 studio v7.8 which can be downloaded from a previous FSP release. This release can be installed into e2 studio v7.8 using the packs, or standalone pack installer, that can be found in the Assets section of this release.
Issue
USB PMSC Driver does not return an error when the user tries to write data to a locked SD Card.
Issue
The USB driver does not work properly when the USB interrupt priority level is higher priority than the configMAX_SYSCALL_INTERRUPT_PRIORITY macro value.
Workaround
Specify a lower priority for the USB interrupt priority than the configMAX_SYSCALL_INTERRUPT_PRIORITY macro value.
Issue
When creating services for a custom profile in the R_BLE Custom Profile RA (QE) View, if you create multiple services with the same UUID or the same abbreviation, the GUI may behave incorrectly.
Workaround
Do not use duplicate UUIDs or abbreviation.
Issue
Exporting a wrapped persistent AES256 key and then re-importing it after destroying the key handle for AES GCM usage will not work.

MD5 Checksums

FSP_Packs_v1.3.0.zip cf64ac2c5e638ac29f447bba6970b5a5
FSP_Packs_v1.3.0.exe e2951772464523db4a8138957a1d825b
fsp_documentation_v1.3.0.zip 38c278e1531a59e4c61ca24037a29697
setup_fsp_v1_3_0_e2s_v2020-07.exe cf76fdd55de9c80ffa109a9d2c32b12f
setup_fsp_v1_3_0_rasc_v2020-07.exe 9be1701cbcd925d4953dad98a160aa8f
MDK_Device_Packs_v1.3.0.zip e4eb4cf786c3e4c563a6f3e2d062f68c

Assets 8

30 Jun 16:49

renesas-fsp-development

v1.2.0

2b8ee0a

v1.2.0

Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 1.2.0.

Download the FSP with e2 studio Installer for this release, setup_fsp_v1_2_0_e2s_v2020-04.exe, from here.

If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v1_2_0_rasc_v2020-04.exe, from here.

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

e2 studio : 2020-04

IAR Compiler : 8.50.1

QE for Capacitive Touch : 1.1.0

QE for BLE : 1.0.0 *Refer to Known Issues section if using this tool

Features Added

PDC driver (r_pdc) now available
SEGGER emWin updated to v6.14a
Arm Compiler used for development and testing updated to v6.14
Arm CMSIS updated to v5.7.0
The PSA Crypto ECDH implementation on RA6 devices was updated to utilize hardware acceleration resulting in significantly better performance

Third Party Software

These third party software solutions are included alongside FSP.

SEGGER emWin: 6.14a

SEGGER J-Link: 6.80c

Visit our knowledge base for other technical updates.

Bug Fixes

Fixes register settings that now allow user to provide external high-potential reference voltage (VREFH0) for ADC16 on the RA2A1.
Removed the "Name" property for rm_wifi_onchip_silex in the configurator since the instance is global.
Fixed issue in DAC8 module where channel 1 was clearing the incorrect bit in MSTPCRD.
Parameter checking can now be enabled in RM_LITTLEFS_FLASH.
Fixed mask/check for available OPAMP channel on RA4W1.
Resolves CAN baud rate specific enum IAR warnings and fixes the range parameter check for prescalar value
Calling R_ADC_InfoGet() on a RA6M1 device would incorrectly read data from a MCU address that could cause Flash API issues if a flash operation was on-going.
USB suspend operation in host mode was not supported.
emWin JPEG input streaming issue fixed for 8-byte aligned mode.
SweynTooth vulnerability fix added to BLE library.
USB HMSC updated to improve performance.

Known Issues

Issue
The QE for BLE tool v1.0.0 does not support e2 studio version 2020-04 or newer. The platform installer for this release will install e2 studio 2020-04.
Workaround
Applications that need to use the QE for BLE tool must use e2 studio v7.8 which can be downloaded from a previous FSP release. FSP v1.2.0 can be installed into e2 studio v7.8 using the packs, or standalone pack installer, that can be found in the Assets section of this release.
Issue
When long file name (LFN) and Unicode UTF16 Support in FreeRTOS + FAT configuration is enabled, build error is thrown by the compiler.
Issue
USB PMSC Driver does not return an error when the user tries to write data to a locked SD Card.
Issue
The USB driver does not work properly when the USB interrupt priority level is higher priority than the configMAX_SYSCALL_INTERRUPT_PRIORITY macro value.
Workaround
Specify a lower priority for the USB interrupt priority than the configMAX_SYSCALL_INTERRUPT_PRIORITY macro value.
Issue
When creating services for a custom profile in the R_BLE Custom Profile RA (QE) View, if you create multiple services with the same UUID or the same abbreviation, the GUI may behave incorrectly.
Workaround
Do not use duplicate UUIDs or abbreviation.

Breaking Changes

Issue
The aws_clientcredential.h file is now generated by default. This can lead to multiple instances of the file if migrating from a previous FSP version where the file was created manually. Include path ordering will dictate which file gets chosen.
Workaround
The new AWS Client Credentials module has an option in its Properties to include a header file. Rename the existing aws_clientcredential.h header file in the project and then add its new name to the Properties for AWS Client Credentials.

Knowledge Base

MD5 Checksums

FSP_Packs_v1.2.0.zip 94e64c02a666499976b14a0e47d220e4
FSP_Packs_v1.2.0.exe 371ca13f358092b650c8b968dfdab246
fsp_documentation_v1.2.0.zip 23ea1a7afc57ed00973c1949163b1280
setup_fsp_v1_2_0_e2s_v2020-04.exe 05c0b922346979874d57497d2cfe3576
setup_fsp_v1_2_0_rasc_v2020-04.exe df94b4c3f442753fe73840a60821a6c6

Assets 8

29 May 16:42

renesas-fsp-development

v1.1.1

fc3e3e5

v1.1.1

Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 1.1.1.

This release includes packs that are installed separately from e2 studio. This means the v1.1.0 platform installer should be installed first. Then the packs for this release can be installed into the new e2 studio.

The packs, and a standalone pack installer, are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Bug Fixes

USB basic parameter checking could not be properly enabled.
BLE did not support timeout feature of RM_BLE_ABS_StartScanning().
It was not documented that USB HHID did not work on the USBHS peripheral of the RA6M3.
Removed AC6 compiler warning when build r_sci_uart generated code.
The ELC module instance name in e2 studio is now shown as being fixed in e2 studio.
The Ethernet PHY target source files were given unique names to resolve an issue with using IAR Embedded Workbench.
Fixed an issue causing multiple copies of mbedtls/error.h being added to a project which could cause a build error.

MD5 Checksums

FSP_Packs_v1.1.1.zip b05d78d21c668c6385ba412bf4d411f2
FSP_Packs_v1.1.1.exe 85818473d0b2dd126cc375b5ff72a613
fsp_documentation_v1.1.1.zip 2f147523b38ce8c721870f5765fc70e3

Assets 6

07 May 02:10

renesas-fsp-development

v1.1.0

cf4b55c

v1.1.0

Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 1.1.0.

Download the FSP with e2 studio Installer for this release, setup_fsp_v1_1_0_e2s_v7_8_0.exe, from here.

If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v1_1_0_rasc_v2020-04.exe, from here.

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

QE for Capacitive Touch : 1.1.0

ARM Compiler : 6.13

QE for BLE : 1.0.0

Features Added

RA4W1 MCU support
Bluetooth Low Energy (rm_ble_abs)
USB Host HID Class (r_usb_hhid)
USB Peripheral HID Class (r_usb_phid)
SEGGER emWin can be used without RTOS
SEGGER emWin now supports 8bpp and 4bpp modes
E2 and E2 Lite emulator support
LittleFS now available as key storage for AWS PKCS11 PAL

Third Party Software

These third party software solutions are included alongside FSP.

Arm CMSIS5: 5.6.0

SEGGER emWin: 6.10f

SEGGER J-Link: 6.70e

Bug Fixes

Register protection was not disabled when writing the VBTCR1 register in the BSP.
Fixed possible #include ordering issue with rm_wifi_onchip_silex
LittleFS default block count is now a function of data flash size. Default block size remains at 128 bytes as the minimum block size for LittleFS is 104 bytes.
Added support for using LittleFS under AWS PKCS11 PAL for key storage.
Fixed an issue causing mbedtls_utils.c from being included in the AWS pack. This file contains functions required for key provisioning.
Fixed issues with horizontal stride setting for GLCDC and emWin
RA Configuration editor now generates correct configuration for COMPSEL0 and does not overwrite register setting for ACMPLP.
In the RA Configuration editor, the ADC module displayed an error if a callback was provided in continuous mode. This has been removed.
There were build errors when adding AGT without using BLE. AGT will now build under both scenarios.
The QSPI documentation stated that SEGGER J-Link supported programming QSPI chips on Port 5 when it is actually Port 3.
Mbed Crypto can now be brought into RA4 and RA2 projects using the RA Configuration editor.

Known Issues

Issue
USB basic parameter checking cannot be enabled.
Issue
The USB driver does not work properly when the USB interrupt priority level is higher priority than the configMAX_SYSCALL_INTERRUPT_PRIORITY macro value.
Workaround
Specify a lower priority for the USB interrupt priority than the configMAX_SYSCALL_INTERRUPT_PRIORITY macro value.
Issue
BLE software does not support timeout feature of RM_BLE_ABS_StartScanning().
Workaround
Set a timer on your own for your scan duration.
Issue
USB HHID module on the RA6M3 does not work on the USBHS peripheral in this release.
Workaround
Use USBFS for USB HHID.
Issue
USB suspend operation in host mode is not supported.
Issue
When creating services for a custom profile in the R_BLE Custom Profile RA (QE) View, if you create multiple services with the same UUID or the same abbreviation, the GUI may behave incorrectly.
Workaround
Do not use duplicate UUIDs or abbreviations.
Issue
There may be build errors when using Mbed TLS and Mbed Crypto in a project. For example, when using Secure Sockets on WiFi or Ethernet. This is due to an include path ordering issue.
Workaround
Change the order of the include paths for your project such that the include for "ra/arm/mbedtls/include" is after the include for "ra/arm/mbed-crypto/include".

MD5 Checksums

FSP_Packs_v1.1.0.zip 5c3c7f44ee825d502e336fb56ad8a77e
FSP_Packs_v1.1.0.exe 1081e0d5d5e1d32f7de011c8b6d94b30
fsp_documentation_v1.1.0.zip 0461fe97bfb45497bb973eb74e6e135e
setup_fsp_v1_1_0_e2s_v7_8_0.exe c7fe802b8d54cb3f91277b7afc5094c3
setup_fsp_v1_1_0_rasc_v2020-04.exe e51b64d292605e3375d5bf731ce29ff5

Assets 8

30 Mar 17:46

renesas-fsp-development

v1.0.0

d0ed16c

v1.0.0

Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 1.0.0.

Download the FSP with e2 studio Installer for this release, setup_fsp_v1_0_0_e2s_v7_8_0.exe, from here.

If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v1_0_0_rasc_v7_8_0.exe, from here.

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

ARM Compiler : 6.13

Features Added

Controller Area Network (r_can)
Digital to Analog Converter (r_dac8)
Interrupt skipping in r_gpt
Three Phase General PWM Timer (r_gpt_three_phase)
Port Output Enable for GPT (r_poeg)
Quad Serial Peripheral Interface Flash (r_qspi)
Sigma Delta Analog to Digital Converter (r_sdadc)
Segment LCD Controller (r_slcdc)
USB Host CDC Class (r_usb_hcdc)
USB Peripheral Mass Storage Class (r_usb_pmsc)
SD/MMC Block Media Implementation (rm_block_media_sdmmc)
USB Host MSC Block Media Implementation (rm_block_media_usb)
Wifi Middleware (rm_wifi_onchip_silex)
Wrapped key support in Mbed Crypto
ECC 384 Hardware Acceleration Support
TLS support using FreeRTOS Secure Sockets for WiFi and Ethernet
CMSIS Neural Network
Arm littlefs file system now available for use on data flash
Temperature compensation and noise immunity add to r_ctsu
C++ projects will build for GCC and IAR
Added support for configuring the USB clock source on the RA4 series MCUs
FreeRTOS MQTT Support
Standalone FSP installer for Windows is now created and included in release
emWin AppWizard support now available
General call now supported on r_iic_slave

Third Party Software

Arm CMSIS5: 5.6.0

Arm littlefs: 2.1.4

SEGGER emWin: 6.10f

SEGGER J-Link: 6.64b

Visit our knowledge base for other technical updates.

Features Modified

Analog to Digital Converter (r_adc)
Capacitive Touch Sensing Unit (r_ctsu)
Digital to Analog Converter (r_dac)
Direct Memory Access Controller (r_dmac). e2 studio configuration only
General PWM Timer (r_gpt)
JPEG Codec (r_jpeg). Encode support added
Key Interrupt (r_kint). e2 studio configuration only
Low Power Modes (r_lpm)
Realtime Clock (r_rtc)
Serial Communications Interface (SCI) I2C (r_sci_i2c)
SD/MMC Host Interface (r_sdhi)
SEGGER emWin Port (rm_emwin_port)
Crypto Middleware (rm_psa_crypto)
Capacitive Touch Middleware (rm_touch)
FreeRTOS version updated
Mbed Crypto version updated
FreeRTOS+FAT. New architecture. Now supports USB and SDHI
USB DMA support added
Documentation links on modules in e2studio now point to locally installed documentation
USB (r_usb_basic) has compatibility breaking API changes
USB Host Mass Storage Class Driver (r_usb_hmsc) has compatibility breaking API changes
USB Peripheral Communication Device Class (r_usb_pcdc) has compatibility breaking API changes
2nd argument of R_ETHER_Read() is changed from "void ** const pp_buffer" to "void * const p_buffer"

Features Removed

None

Bug Fixes

The r_sdhi module was not able to properly set the activation event for the r_dmac module when r_dmac was chosen as its dependency.
The BSP for RA2 parts did not fully follow the flow chart for turning off the TRNG out of reset.
The interrupts in r_sci_i2c were not populated correctly in the generated i2c_master_cfg_t structure.
The LPM snooze cancel source was not available in the configuration tool, and the enumeration options were incorrect for RA4 and RA2 devices.
R_RTC_PeriodicIrqRateSet could cause the application to hang.
Multiple selections are available for LPM wake sources, GPT input sources, ADC channels, and KINT channels. These properties are not backward compatible and must be reconfigured.
The period calculation for r_gpt and r_agt could generate build errors for some configurations.
The KSZ8091RNB PHY initialization code for for the EK-RA6M3 incorrectly configured the PHY for 50MHz mode when it should have been 25MHz.
The ADC was not functional on RA6M1 because the PGA was not initialized.
Added missing externs to generated SPI structure header.
The Activation Source property in the XML for r_dtc was a text field instead of a list. This could cause build errors if the text did not match a vector in the system.
Fixed an issue where Snooze mode was not being enabled correctly on RA2 devices.
In bsp_clock_init, R_BSP_SoftwareDelay() was being called before SystemCoreClockUpdate(). This had undefined behavior if sub-clock was chosen as the source clock in the BSP.
For GCC projects, both malloc and the FreeRTOS memory allocation prvPortMalloc allocate memory from the same memory pool. Existing GCC projects need to update the linker script so that __HeapBase is defined at the start of g_heap (from startup.o).
The transfer_info::irq setting was previously hard coded to TRANSFER_IRQ_EACH for DMAC. transfer_info_t::irq setting can now be configured for TRANSFER_IRQ_EACH, or TRANSFER_IRQ_END.
The Activation Source property in the XML for r_dtc was a text field instead of a list. This could cause build errors if the text did not match a vector in the system.
Configuration ID changed for GPT "Duty Cycle Range" configuration (not backwards compatible).
Writes to FIFO transmit register are updated in the driver implementation to fix the UART write failure on RA2A1 with FIFO enabled.
Added data flash enable for LP devices to R_BSP_WarmStart. Data flash will now only be enabled in the r_flash_lp module if it was not already enabled previously.
Fixed issue with improper generation of parameter checking macro for rm_wifi_onchip_silex.
When configuring the VREF pins on RA4M1, the pin configuration showed errors and the generated pin data was incorrect.
FreeRTOS was using BSP_CFG_IRQ_MASK_LEVEL_FOR_CRITICAL_SECTION to set basepri in vPortEnterCritical. It has been changed to use configLIBRARY_MAX_SYSCALL_INTERRUPT_PRIORITY.
The "MCU Vcc (mV)" option in the BSP properties would not allow a VCC entry larger than 4.6V. This has been fixed to allow up to 5.5V.
When using the AC6 compiler, heap size is configured using Heap Size on the BSP tab instead of in the <mcu>.scat scatter file. Existing projects must update the scatter file to use this change.

Known Issues

Issue
When provisioning the device using the AWS-provided vAlternateKeyProvisioning(), a build error will occur because of a missing function.
Workaround
Download mbedtls_util.c and add the file to your application build.
Issue
The AWS Device Provisioning code writes directly to data flash. The Mbed Crypto persistent storage littlefs module also writes to data flash. Using both of these features in the same project will cause data corruption.
Workaround
Modify rm_littlefs_flash_cfg.h to add a new definition "#define RM_LITTLEFS_FLASH_DATA_START" and define it to a sufficient offset such that there is enough space for the AWS Device Provisioning credentials at the beginning of data flash. For example, a RSA2048 private key and a certificate in PEM format takes up about 1700 and 1100 bytes respectively. It is also necessary to change the "block count" value in "LittleFS on Flash" module to reflect the reduced data flash size that can be utilized by littlefs.
Issue
The default values for the "LittleFS on Flash" needs to be modified. The default value for "Block Size (bytes)" is 128 when it should be 64 bytes. The default value of "Block Count" is 1024 which will vary depending on the MCU being used.
Workaround
In the module properties for "LittleFS on Flash" change "Block Size (bytes)" to 64. Also, change "Block Count" such that Block Size multiplied by Block Count is the size of the data flash on the MCU.

Knowledge Base

Checksums

FSP_Packs_v1.0.0.exe 0188b4d3de034c8b1e1ad6aa2384119c
setup_fsp_v1_0_0_e2s_v7_8_0.exe c688640ab4799223d9c2106cc7f05600
setup_fsp_v1_0_0_rasc_v7_8_0.exe 6e1422d50b17e1b3147caea275e74f9b

Assets 8

07 Oct 04:23

renesas-fsp-development

v0.8.0

a13e788

v0.8.0

Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 0.8.0.

Download the FSP with e² studio Installer for this release from here. This is also available in the Assets section of this release (setup_fspv0_8_0_e2s_v7_6_0.exe).

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

e2 studio: e2 studio v7.6.0

GCC Compiler : 8-2019-q3-update

ARM Compiler : 6.12

Modules Added

Board Support Package (bsp)
High-Speed Analog Comparator (r_acmphs)
Low-Power Analog Comparator (r_acmplp)
Analog to Digital Converter (r_adc)
Asynchronous General Purpose Timer (r_agt)
Clock Frequency Accuracy Measurement Circuit (r_cac)
Clock Generation Circuit (r_cgc)
Cyclic Redundancy Check (CRC) Calculator (r_crc)
Capacitive Touch Sensing Unit (r_ctsu)
Digial to Analog Converter (r_dac)
Direct Memory Access Controller (r_dmac)
Data Operation Circuit (r_doc)
D/AVE 2D Port Interface (r_drw)
Data Transfer Controller (r_dtc)
Event Link Controller (r_elc)
Ethernet (r_ether)
Ethernet PHY (r_ether_phy)
High-Performance Flash Memory (r_flash_hp)
Low-Power Flash Memory (r_flash_lp)
Graphics LCD Controller (r_glcdc)
General PWM Timer (r_gpt)
Interrupt Controller Unit (r_icu)
I2C Master on IIC (r_iic_master)
I2C Slave on IIC (r_iic_slave)
I/O Ports (r_ioport)
Independent Watchdog Timer (r_iwdt)
JPEG Codec (r_jpeg)
Key Interrupt (r_kint)
Low Power Modes (r_lpm)
Low Voltage Detection (r_lvd)
Realtime Clock (r_rtc)
Serial Communications Interface (SCI) I2C (r_sci_i2c)
Serial Communications Interface (SCI) SPI (r_sci_spi)
Serial Communications Interface (SCI) SPI (r_sci_uart)
SD/MMC Host Interface (r_sdhi)
Serial Peripheral Interface (r_spi)
Serial Sound Interface (r_ssi)
Universal Serial Bus (r_usb_basic)
Universal Serial Bus Host Mass Storage Class (r_usb_hmsc)
Universal Serial Bus Peripheral Communication Device Class (r_usb_pcdc)
Watchdog Timer (r_wdt)
SEGGER emWin Port (rm_emwin_port)
Amazon FreeRTOS Port (rm_freertos_port)
Crypto Middleware (rm_psa_crypto)
Capacitive Touch Middleware (rm_touch)

Third Party Software

Amazon FreeRTOS: 201906.00_Major

Arm CMSIS5: 5.5.1

Arm Mbed Crypto: 1.1.0

SEGGER emWin: 5.50.f