v6.5.1

Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 6.5.1.

This release includes packs that are installed separately from e2 studio. This means the v6.5.0 platform installer should be installed first, then the packs in this release can be installed into the new e2 studio.

Bug Fixes

• Fixed SDRAM initialization during startup issue

See fixed GitHub Issues for this release.

Knowledge Base

Visit our knowledge base for other technical updates.

SHA-256 Checksums

• FSP_Packs_v6.5.1.zip 66c85416c8f45f2212a2e30ca70380469f7712f4a69b12498f599d38ab3ade4a
• FSP_Packs_v6.5.1.exe 3b7376ab4822bc7d9497f04e8e123f2aaa456976124cc156d73a433b965ee417
• fsp_documentation_v6.5.1.zip 19a23dd5ef0d4f911fb4db72813ad700fd3298f2a2766a224bae34cfca33cabd
• MDK_Device_Packs_v6.5.1.zip d2916cdd8e43d49104ad543d6ed0fd2d0f8ee91ee27e7adfa4221d605432da81

v6.5.0

Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 6.5.0.

Minimum e2 studio version for FSP 6.5.0 is e2 studio 2026-04.2.

Download the FSP with e2 studio Windows installer for this release, setup_fsp_v6_5_0_e2s_v2026-04.2.exe, from here.

Download the FSP with e2 studio Linux installer for this release, setup_fsp_v6_5_0_e2s_v2026-04.2.xz.run, from here. Refer to installation steps for information on installing e2 studio and related software components in a Linux PC.

Download the FSP with e2 studio macOS (Apple Silicon) installer for this release, setup_fsp_v6_5_0_e2s_v2026-04.2.pkg, from here. Refer to installation steps for information on installing e2 studio and related software components in a macOS PC.

If you are using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for your operating system.

• For Windows download setup_fsp_v6_5_0_rasc_v2026-04.2.exe from here
• For Linux download setup_fsp_v6_5_0_rasc_v2026-04.2.xz.run from here
• For macOS (Apple Silicon) download setup_fsp_v6_5_0_rasc_v2026-04.2.pkg from here

Post - FSP v6.5.0 changes to toolchain support

Future releases of FSP will no longer ship with the GCC toolchain integrated within the combined e2 studio / FSP platform installer. The use of the GCC toolchain with FSP will still be supported, and an option in the platform installer will allow GCC to be downloaded from the internet and installed as part of the overall install process. Or alternatively it is possible to link e2 studio to an installation of the GCC toolchain already on the user's computer.

Note : The LLVM toolchain / Arm Toolchain for Embedded (ATfE) will continue to be integrated within the e2 studio / FSP platform installer.

With FSP 6.3.0 and later, when using the LLVM toolchain the compiler optimization level is set to -Os by default for RA4/RA6/RA8 MCUs, whereas previous FSP's would use -O2. This has been done as with LLVM, -Os causes a balance of optimizations similar to GCC's -O2 option.
Note that for RA0/RA2 MCUs, where keeping memory size to a minimum is typically of primary importance, the -Oz optimization level is selected by default.

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

• Arm GNU Toolchain: 13.2

• LLVM Embedded Toolchain for Arm: 21.1.1

• IAR Compiler: 9.70.4

• ARM Compiler: 6.24

• QE for Capacitive Touch: 4.3.0

• QE for Display: 3.7.0

• QE for BLE: 1.8.0

• QE for Motor: 1.6.0

• QE for Camera: 1.2.0

• QE for AFE: 2.4.0

• QE for OTA: 2.3.0

• QE for USB: 2.0.0

• e2 studio: 2026-04.2

• RASC: 2026-04.2

• Renesas E2 and E2 Lite: 2.8.1

• SEGGER J-Link: 9.42

New Features

• MCUboot Solution Template Enhancements:

  • Single‑Image MCUboot Templates:
    • Added MCUboot single image solution template for RA6 CM4 devices (RA6M1, RA6T1, RA6M2, RA6M3) using mbedtls
    • Added MCUboot single image solution template for cm33 devices (RA6M4, RA6M5, RA4M2, RA4M3) using mbedtls with crypto accelerator
    • Added MCUboot single image solution template for cm33 devices (RA6M4, RA6M5, RA6E1, RA4M2, RA4M3, RA4E1) using mbedtls with crypto accelerator
    • Added MCUboot single image solution template for CM85 devices using mbedtls with crypto accelerator
  • MCUboot with MMF (Mirrored Memory Flash) Support:
    • Added MCUboot single image solution template in MMF mode for RA6 CM4 devices (RA6M1, RA6T1, RA6M2, RA6M3) using mbedtls
    • Added MCUboot single image solution template in MMF mode for RA2A2 using mbedtls
  • Multi‑Image MCUboot Templates:
    • Added MCUboot multi-image image solution template in Overwrite mode for CM85 devices (RA8P1, RA8D2, RA8M2, RA8T2) using mbedtls

• Middleware and Feature Additions:

  • Added support for Host Video Class (HUVC) driver
  • Updated LVGL graphic library to version v9.5
  • Added support for LwIP SNMP application
  • Added link detection support for all RMAC port from r_layer3_switch

• Updated FSP pin configuration support for:

  • RA8M1, RA8M2 and RA8T1 (169‑BGA package)
  • RA4L1 (72-WLCSP package)
  • RA0E1 (20-TSSOP package):
    • Removed the sub-clock and its pins from FSP clock configuration and pin configuration
    • Initialized the sub-clock related registers per TU

• Cryptography and Security Updates:

  • Added HMAC-SHA3 224/256/384/512 feature for RSIP-E50D
  • Added xDLMS InitiateRequest message decryption feature for RSIP-E11A

• Updated to MbedTLS version 3.6.6

Fixes and Improvements

• Added support to disable the TAU_PWM master-channel interrupt

• OFS register ZHUK is placed after PBPS

• Fixed the issue where the IPV settings are not applied to the VLAN and Layer 3 entries

• Support MAC table searches by source MAC address, destination MAC address, or both

• Added support of lwIP PPP configuration

• Updated the CCD setting description in r_ioport to notify users to enable CCD support when using CCD pins

• Improved CTSU2 diagnosis feature in r_ctsu

• Fixed issues in CTSU2 CCO correction for devices with certain characteristics (announced in R20TS1229EJ0100), and CTSU1 CCO correction for RA4M2 and RA4M3

• Fixed MPU region size check to avoid configuring zero size regions when D-Cache is enabled for RA8 devices

• RSIP Protected Mode driver improvements:

  • Reduced code size for RSIP-E51A and RSIP-E50D PM drivers
  • Updated control procedures for RSIP-E11A PM driver to code size reduction version
  • Updated CAVP certified module for RSIP-E31A PM driver due to re-acquisition of CAVP certification
  • Bugs fixed:
    - Buffer size of cert info and wrapped secret was not defined correctly when using brainpool curve
    - Buffer size of input message was not defined correctly when using KDF-SHA 512

• Updated PQC-Lib V2.00 with stack overflow bug fix

• Fixed incorrect bit length for SCE9 PSA Crypto wrapped keys

• Updated description for RAMP in MDF

• Fixed link bug r_ether with ICS1894 PHY

• Updated IAR toolchain to v9.70.4

• Fixed build error when user custom PHY function is used on ESWM

• Fixed rm_motor_control callback issue when 2 motors are enabled

• rm_motor_pm_foc module:

• Fixed a unit typo where degree values were assigned to variables intended to be in radians

• Optimized the sine and cosine calculations in the transform function within the current control loop of rm_motor_pm_foc_inner

• Fixed typos in rm_motor_pm_foc.h:

  • Renamed p_to_outer_active to p_to_inner_active in the outer module
  • Renamed p_to_outer_copy to p_to_inner_copy in the outer module

• rm_motor_sensor module:

  • Fixed a unit typo where degree values were stored in variables intended for radians
  • Fixed an issue where the sign of e_q inverted during deceleration, causing a loss of value continuity and resulting in incorrect angle integration

• Added D-Cache enabled support for RA8 devices for below modules:

  • DTC: Review DTC documentation for details
  • SPI_B: Review SPI_B documentation for details
  • SCI_B_SPI: Review SCI_B_SPI documentation for details
  • SCI_B_UART: Review SCI_B_UART documentation for details

• Corrected the copyright notice errors in the CAVP module source files for RSIP-E31A

• Improved rm_psa_crypto SHA-256 code to handle message lengths that are multiples of 128 bytes

• Updated workaround document for e2 Studio 2026-04 pin configuration tooling

• Updated the BSP usage notes and Cortex-M85 cache document with information relevant to DTC driver D-Cache support

• Fixed an error in the macro definitions that...

v6.4.0

Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 6.4.0.

Minimum e2 studio version for FSP 6.4.0 is e2 studio 2025-12

Download the FSP with e2 studio Windows installer for this release, setup_fsp_v6_4_0_e2s_v2025-12.exe, from here.

Download the FSP with e2 studio Linux installer for this release, setup_fsp_v6_4_0_e2s_v2025-12.xz.run, from here. Refer to installation steps for information on installing e2 studio and related software components in a Linux PC.

Download the FSP with e2 studio macOS (Apple Silicon) installer for this release, setup_fsp_v6_4_0_e2s_v2025-12.pkg, from here. Refer to installation steps for information on installing e2 studio and related software components in a macOS PC.

If you are using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for your operating system.

• For Windows download setup_fsp_v6_4_0_rasc_v2025-12.exe from here
• For Linux download setup_fsp_v6_4_0_rasc_v2025-12.xz.run from here
• For macOS (Apple Silicon) download setup_fsp_v6_4_0_rasc_v2025-12.pkg from here

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

• Arm GNU Toolchain: 13.2

• LLVM Embedded Toolchain for Arm: 21.1.1

• IAR Compiler: 9.70.2

• ARM Compiler: 6.24

• QE for Capacitive Touch: 4.2.0

• QE for Display: 3.7.0

• QE for BLE: 1.8.0

• QE for Motor: 1.5.1

• QE for Camera: 1.2.0

• QE for AFE: 2.4.0

• QE for OTA: 2.3.0

• QE for USB: 2.0.0

• e2 studio: 2025-12

• RASC: 2025-12

• Renesas E2 and E2 Lite: 2.7.1

• SEGGER J-Link: 9.14a

New Features

• Added support for RA0E3 devices

  • Includes FPB-RA0E3 board support

• Added support for EK-RA8T2 board

• Added support for VSC8541 PHY on EK-RA8T2 board

• Added HMAC-SHA 512/224, 512/256 support for RSIP-E51A and RSIP-E50D PM drivers

• Added support for lwIP SNTP application

• Added support for gPTP middleware

• Added Motor Control Middleware support

• Added Trajectory module support in Motor Control Middleware

• Added Motor HAL driver support in Motor Control Middleware

• Added support for Hall sensor and BEMF sensor modules in Motor Control Middleware

• Added xDLMS InitiateRequest message decryption feature on RSIP-E31A PM driver

• Added KDF-SHA 512 support for RSIP-E51A and RSIP-E50D PM drivers

• Added features to verify public key certificate and key import using RSA algorithm on RSIP-E51A and RSIP-E50D PM drivers

• Released a new CAVP certified module for RSIP-E31A Protected Mode driver

• Added support for 24-pin packages R7FA2T1073CNK and R7FA2T1074CNK

• Arm Compiler for Embedded (Arm Compiler 6) updated to version 6.24

Fixes and Improvements

• Added SPI support to r_ble_gtl

• r_pdm: Fixed sample rate calculation in the configurator. The calculation was off by a factor of 2 due to decimation performed by the low-pass filter in hardware

• Simplified OSPI_B MDF configuration and constraints related to DOTF support

• Resolved an IAR compiler build failure that occurred when using the PQC crypto module with RA8 devices

• Enabled PLL startup when HOCO is selected as the clock source and MOSC is not populated

• Fixed edge case in PQC where a NULL check prevents a valid 0x00000000 address from being used as a pointer

• Fixed MCUBoot build failure when the Flash LP Bank Swap setting is configured to Instant

• Corrected the configuration for L3 fowarding feature in r_layer3_switch

• Updated module version information of the RSIP Protected Mode driver

• Added list of HAL drivers and supported RA MCUs to the FSP User's Manual

• Added support for 8 byte transfer size option in DTC

• Added support for 8 byte transfer size option in DMAC

• Added TFLM support on RA MCUs without NPU

  • Please refer to https://renesas.github.io/fsp/group___r_m___e_t_h_o_s_u.html for configuring C/C++ build settings.

• Added ML-DSA support for MCUboot signing

• r_sci_b_uart: Added new configuration parameter 'Extra > TXI/TEI Synchronization Delay Cycles' to address issue where the last transmit data was not always output when SCICLK was much slower than PCLK

• Removed AES-XTS key injection feature for RSIP-E31A according to the support policy.

• Added PM FOC motor algorithm support in Motor Control Middleware

• Added Motor Tuning module for permanent magnet (PM) motors in Motor Control Middleware

• Moved GTETRGx pins from GPT to GPT_POEG in RA6T2 Pin page

• Added support of UART_EVENT_TX_DATA_EMPTY event for SAU UART

• Updated r_rmac diver to support L2 over L3 fabric

• Secure and privilege attributes for NPU to access memories shall be configured via properties

• Updated control procedures for RSIP-E31A PM driver to code size reduction version

• Fixed GCC C++ build warning in ThreadX port

• Updated Segger JLink version to 9.14

• Added constraint to check etherc buffer to netxduo

• Fixed error on EtherCAT SSC Port when adding one more timer instance

Known Issues

• Solution Projects (TrustZone, Multicore):
  • There are issues related to pin configuration synchronization between projects in e2 studio 2025-12. Refer to this document for workarounds
• RA0E1:
  • e2 studio projects automatically reset compiler optimization to a Size setting on every generate or build operation
  • Add optimization flags (e.g. -O0) manually to 'Other optimization flags' to override the -Oz setting
  • HS400x and ZMOD4xxx sensors cannot be used on RA0E1
  • FS3000 sensor does not support SAU-I2C driver
• Selecting 'Safely Remove Hardware and Eject Media' on Windows and eject the mass storage (PMSC), when
  using USBX composite device (PCDC+PMSC), the Windows Explorer for PMSC does not disappear.
• PMSC may not work properly when USBX Composite Device (PCDC+PMSC) is connected to specific Linux OS
  (USB Host).
• EWARM version 9.70.2 does not contain support for RA0E3. To develop with IAR for these devices, it is necessary to install a support patch file for which can be downloaded by EWARM v9.70.2 users from the IAR MyPages system
  • RA0E3 (arm_Renesas_RA0E3_20260106_1.zip)
• When importing projects in e2 studio that were created using a previous toolchain version be sure that the version specified in the project is integrated (Window->Preferences->Renesas->Renesas Toolchain Integration) or select the appropriate toolchain version if upgrading the project to a later FSP version.
• When upgrading RA6T2 projects to FSP 6.4.0, the GTETRGx pin assignments might be lost, please re-assign the pins manually.
• When upgrading RA0E1/E2/L1 projects to FSP 6.4.0, the SAU_SPI00 pin group might be changed, please restore the pin group manually.
• For known issues in the tools, please refer to the respective tool's release notes e2 Studio RN.

Visit GitHub Issues for this project.

Third Party Software

These third party software solutions are included alongside FSP.

• Amazon coreHTTP: 3.1.1+renesas.0

• Amazon coreMQTT: 2.3.1

• Amazon corePKCS11: 3.6.2

• Amazon coreJSON: 3.3.0

• Amazon FreeRTOS+FAT: f834aee4

• [Am...

v6.3.1

Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 6.3.1.

This release includes packs that are installed separately from e2 studio. This means the v6.3.0 platform installer should be installed first, then the packs in this release can be installed into the new e2 studio.

Bug Fixes

• Fixed TrustZone boundary setting issue in e2 studio projects for devices requiring a non-secure buffer for Ethernet operation (RA6M5, RA6M4, RA6E1)

See fixed GitHub Issues for this release.

Knowledge Base

Visit our knowledge base for other technical updates.

SHA-256 Checksums

• FSP_Packs_v6.3.1.zip dc1f8791c5d07c7ed2897929ccadccc2cfb54629c808fc112eb46705f92791a1
• FSP_Packs_v6.3.1.exe c0140fa434efdc1232a0b462b9eacdce06831785398a85b0f95a3ecc4bdfd266
• fsp_documentation_v6.3.1.zip 4ae0826178cfe1467bf3e96f84105dee779759e7a4af8d0cf006f925344f7441
• MDK_Device_Packs_v6.3.1.zip c0ecf2a914bb68e4bb25133a66da5aed8e5ddee1ea5a1dc29f2e56e769052a21

v6.3.0

Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 6.3.0.

Minimum e2 studio version for FSP 6.3.0 is e2 studio 2025-12

Download the FSP with e2 studio Windows installer for this release, setup_fsp_v6_3_0_e2s_v2025-12.exe, from here.

Download the FSP with e2 studio Linux installer for this release, setup_fsp_v6_3_0_e2s_v2025-12.xz.run, from here. Refer to installation steps for information on installing e2 studio and related software components in a Linux PC.

Download the FSP with e2 studio macOS (Apple Silicon) installer for this release, setup_fsp_v6_3_0_e2s_v2025-12.pkg, from here. Refer to installation steps for information on installing e2 studio and related software components in a macOS PC.

If you are using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for your operating system.

• For Windows download setup_fsp_v6_3_0_rasc_v2025-12.exe from here
• For Linux download setup_fsp_v6_3_0_rasc_v2025-12.xz.run from here
• For macOS (Apple Silicon) download setup_fsp_v6_3_0_rasc_v2025-12.pkg from here

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

• Arm GNU Toolchain: 13.2

• LLVM Embedded Toolchain for Arm: 21.1.1

• IAR Compiler: 9.70.2

• ARM Compiler: 6.23

• QE for Capacitive Touch: 4.2.0

• QE for Display: 3.7.0

• QE for BLE: 1.8.0

• QE for Motor: 1.5.1

• QE for Camera: 1.2.0

• QE for AFE: 2.4.0

• QE for OTA: 2.2.0

• QE for USB: 2.0.0

• e2 studio: 2025-12

• RASC: 2025-12

• Renesas E2 and E2 Lite: 2.7.1

• SEGGER J-Link: 8.92

New Features

• Added support for PTX Native-Tag add-on API on PTX105R NFC Reader

• Added CEU image capture mode support with optional scale down and YCbCr422 to YCbCr420 format conversion

• Added support for all compare match events on GPT module

• Added support for SPI burst transfer without delay, which allows sending multiple data frames consecutively without any delay between frames

• Added support for USB0 and USB1 simultaneous operation

• MCUBoot supports updating multi images, especially for multi-core boards

• Updated PQC-Lib to v2.00 which adds support for MLKEM-1024 and MLDSA-87 algorithms

• An SBOM (.spdx) is now generated and uploaded as part of FSP releases

• Added FSP solutions templates for TrustZone projects

• Added Modbus Serial slave module support

• lwIP

  • Added lwIP NetBIOS name server application support
  • Added lwIP SMTP Client application support
  • Added lwIP Iperf application support

• Added HAUD (audio 2.0) driver support

• Added KDF-HMAC feature for RSIP-E11A PM driver

• Added brainpool curve support for ECDH feature for RSIP-E51A and RSIP-E50D PM driver

• Added prehash support for ML-DSA

• Added Per Stream Filtering and Policing (PSFP) feature support

• Added frame preemption feature support on RA8M2, RA8D2, RA8T2, RA8P1 Ethernet drivers

• Allow override of d1_cacheflush() and d1_cacheblockflush() r_drw D1 layer functions

Fixes and Improvements

• Fixed default support of battery charging in USB stack for some devices

• Support for the mbedtls_aes_cmac_prf_128 hardware accelerator function

• Fixed the incorrect address space in MCUboot multi-image by updating the linker configuration

• Added workaround document for e2 studio 2025-12 Solution project pin config issues

• Fixed TrustZone guard function generation for R_GPT_CompareMatchSet()

• Updated r_agt usage notes regarding restrictions with event counting and low power modes per TU TN-RA*-A0133B/E

• Added asymmetric plaintext key generation support for SCE9 and RSIP-E51A in PSA Crypto

• Updated SCE9 Protected Mode APIs to check parameters when parameter checking macro SCE_CFG_PARAM_CHECKING_ENABLE is enabled

  • The parameter checking that was already present in previous version is also reflected only if SCE_CFG_PARAM_CHECKING_ENABLE is enabled.

• R_VIN:

  • Fixed UDS Passband calculation when image scaling is used
  • Fixed generation of Image Stride setting and runtime buffer size
  • UDS Enabled state now automatically determined based on configured image input and output sizes

• Updated KDF-SHA feature for RSIP-E11A PM driver to remove the restriction on input message length (up to 64 bytes)

• Updated LLVM version to 21.1.1

• Updated IAR toolchain to v9.70.2

  • IAR v9.70.2 includes new device support for RA0L1, RA2T1, RA4C1, RA8D2, RA8M2, RA8P1, and RA8T2

• Reduced code size of AES algorithm for RSIP-E11A PM driver

• Reduced total code size for RSIP Protected Mode driver for RSIP-E31A

• Updated AES-XTS control procedures for RSIP-E51A and RSIP-E50D PM driver in order to satisfy CMVP key requirement

• Corrected RA8M2 SiP (LFBGA-303) and HLQFP-176 part numbers

• Added missing RA8T2 SiP (LFBGA-303) part numbers

• r_ospi_b:

  • Fixed code generation to use the erase table for the initial command set in the spi_flash_cfg_t config structure for backwards compatibility

• rm_block_media_spi, rm_levelx_nor_spi, rm_littlefs_spi_flash:

  • Updated OSPI_B start address macro usage to support devices with multiple OSPI_B peripherals

• Added support to use decimal input type for TAU PWM duty cycle percent

• Fixed RMAC read overflow issue

• Ocrypto version updated to v3.9.4

• Enabled Ocrypto for RA0E1, RA0E2, RA0L1, RA2E2, and RA2L1 devices

• Fixed build error when USBX Host Hub is enabled

• Reordered HCDC type assignment to fix CDC data transfer issue for Host Composite and HCDC_ECM when parameter checking mode is enabled

• Reduced total code size for RSIP Protected Mode driver for RSIP-E11A

• Platform installer updated to include e2 studio 2025-12

• Removed a vulnerability in the RSA signature verification APIs in SCE Protected Mode

• Segger JLink version updated to 8.92

• Added a note about the counter value to the R_TML_StatusGet API description

• Fixed issue where CANFD CH0 RNC setting was incorrectly applied to CH1(instance 1)

• Updated UARTA permissible baud rate error formula per TU

• E2 Emulator support updated to v2.7.1

Known Issues

• Solution Projects (TrustZone, Multicore):

  • There are issues related to pin configuration synchronization between projects in e2 studio 2025-12. Refer to this document for workarounds.

• RA0E1:

  • e2 studio projects automatically reset compiler optimization to a Size setting on every generate or build operation
  • Add optimization flags (e.g. -O0) manually to 'Other optimization flags' to override the -Oz setting
  • HS400x and ZMOD4xxx sensors cannot be used on RA0E1
  • FS3000 sensor does not support SAU-I2C driver

• Selecting 'Safely Remove Hardware and Eject Media' on Windows and eject the mass storage (PMSC), when

  using USBX composite device (PCDC+PMSC), the Windows Explorer for PMSC does not disappear.

• PMSC may not work properly when USBX Composite Device (PCDC+PMSC) is connected to specific Linux OS

  (USB Host).

• For known issues in the tools, please refer to the respective tool's release notes e2 Studio RN

Deprecations

• AES-XTS key injection feature for RSIP-E31A is deprecated and will be removed in the next major release

• NPU secure and privilege attributes in rm_ethosu are deprecated; configure via OFS2 instead

Visit GitHub Issues for this project.

Third Party Software

These third par...

v6.2.0

Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 6.2.0.

Minimum e2 studio version for FSP 6.2.0 is e2 studio 2025-10

Download the FSP with e2 studio Windows installer for this release, setup_fsp_v6_2_0_e2s_v2025-10.exe, from here.

Download the FSP with e2 studio Linux installer for this release, setup_fsp_v6_2_0_e2s_v2025-10.xz.run, from here. Refer to installation steps for information on installing e2 studio and related software components in a Linux PC.

Download the FSP with e2 studio macOS (Apple Silicon) installer for this release, setup_fsp_v6_2_0_e2s_v2025-10.pkg, from here. Refer to installation steps for information on installing e2 studio and related software components in a macOS PC.

If you are using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for your operating system.

• For Windows download setup_fsp_v6_2_0_rasc_v2025-10.exe from here
• For Linux download setup_fsp_v6_2_0_rasc_v2025-10.xz.run from here
• For macOS (Apple Silicon) download setup_fsp_v6_2_0_rasc_v2025-10.pkg from here

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

• Arm GNU Toolchain: 13.2

• LLVM Embedded Toolchain for Arm: 18.1.3

• IAR Compiler: 9.70.1

• ARM Compiler: 6.23

• QE for Capacitive Touch: 4.2.0

• QE for Display: 3.6.0

• QE for BLE: 1.8.0

• QE for Motor: 1.5.0

• QE for Camera: 1.1.0

• QE for AFE: 2.4.0

• QE for OTA: 2.2.0

• QE for USB: 2.0.0

• e2 studio: 2025-10

• RASC: 2025-10

• Renesas E2 and E2 Lite: 2.6.2

• SEGGER J-Link: 8.74

New Features

• Added support for RA8D2 devices

  • Includes EK-RA8D2 board support

• Added support for RA8M2 devices

  • Includes EK-RA8M2 board support

• Added support for 303 pin devices of RA8M2, RA8D2, RA8P1 and RA8T2

• Added support for running NetX Duo using Ethernet drivers without zero-copy (including r_rmac)

• This feature has limited performance and is only meant to supplement Ethernet drivers that may not have zero-copy functionality available immediately.

• R_SCI_B_SPI: Added support for receive sampling timing adjustment and FIFO mode with DTC/DMAC

• Added timestamp function support for r_rmac

• Added zero-copy Ethernet support for RA8M2, RA8D2, RA8T2, and RA8P1

• Added DMAC support for r_spi_b

• Added BSP configuration options under 'I/O Ports|Voltage Mode' which configure I/O ports based on VCC and VCC2 voltage levels

  • Applicable to RA8 devices, which provide the Low Voltage Operation Control Register (LVOCR)

• Added ECC support to r_mram

• Added third-party libraries for LVGL

• Added support for NetxDuo Ethernet zerocopy feature on RA8M2, RA8D2, RA8T2 and RA8P1

• Added USB HAUD support for BareMetal and FreeRTOS

• Added ChaCha20-Poly1305 feature for RSIP-E50D Protected Mode driver

• Updated CAVP certified module for RSIP-E51A Protected Mode driver due to re-acquisition of CAVP certification

• Added support for Post Quantum Crypto (PQC) ML-DSA-44 and ML-DSA-65 key generation, signing and verification

• Added SHA-3 feature for RSIP-E50D PM driver

• Added Frame Replication and Elimination Support for Reliability (FRER) feature for Ethernet on RA8M2, RA8D2, RA8T2, and RA8P1

• Added KDF-HMAC feature for RSIP-E31A PM driver

• Added new FSP Solution Templates for supported RTOS

• Added HMAC-SHA 512/224 and 512/256 features for RSIP-E31A PM driver

Fixes and Improvements

• Updated VBAT voltage threshold value for RA4C1 in r_lvd module

• Fixed an RSA-related warning in rm_netx_crypto on RA8E2 devices

• Fixed rm_littlefs_flash build failure on r_mram

• Updated PQC to use PSA SHA3 APIs

  • Added SHA3 HW Acceleration for E50D devices

• Updated solution project templates to use new hal_warmstart.c

• Fixed possible infinite register wait loop in r_agt when an AGT interrupt occurs while executing an AGT driver function and the driver is in one-shot mode

• Platform installer updated to include e2 studio 2025-10

• Updated symbolic names of LED pins for FPB-RA8E1

• Improved SCI LIN auto synchronization bitrate tolerance to +/- 14%

• AES code size reduction for RSIP-E31A PM driver

• Improved ECDSA P-512 performance for RSIP-E51A and RSIP-E50D PM driver

• Fixed USB HCDC-ECM initializaztion error

• Fixed incorrect setting of PLL Multipliers above 255.66x via r_cgc

• Updated Usage Notes and constraints for using MbedTLS with lwIP HTTP and MQTT applications

• Updated display and tooltip of Clocks for RA0 MCUs

• Fixed LLVM build issue in LwIP HTTPS server when using mbedTLS

• Reduced code size of ECDSA verification feature for RSIP-E31A Protected Mode driver

• Fixed potential hang in multicore project boot code on devices with NPU

• Removed padding from OSIS region that could result in out-of-bounds SREC data

• Fixed an issue in KDF-SHA feature for RSIP-E11A where the generated DKM was incorrect when the input message length was 55 bytes

• FSP Common API updated to v1.14.0

• Support Multiple Interfaces for lwIP TCP/IP

• Restricted FSP Blinky Solution Templates to RA development boards

• Fixed a few constraint-message references of r_vin

• Updated R_ADC_D_SnoozeModePrepare to set the ADM0.ADCE bit after setting the ADM2.AWC bit

• Segger JLink version updated to 8.74

Known Issues

• RA0E1:

  • e2 studio projects automatically reset compiler optimization to a Size setting on every generate or build operation
  • Add optimization flags (e.g. -O0) manually to 'Other optimization flags' to override the -Oz setting
  • HS400x and ZMOD4xxx sensors cannot be used on RA0E1
  • FS3000 sensor does not support SAU-I2C driver

• Selecting 'Safely Remove Hardware and Eject Media' on Windows and eject the mass storage (PMSC), when

  using USBX composite device (PCDC+PMSC), the Windows Explorer for PMSC does not disappear.

• PMSC may not work properly when USBX Composite Device (PCDC+PMSC) is connected to specific Linux OS

  (USB Host).

• EWARM version 9.70.1 does not contain support for RA0L1, RA2T1, RA4C1, RA8D2, RA8M2, RA8P1 and RA8T2. To develop with IAR for these devices, it is necessary to install a support patch file for which can be downloaded by EWARM v9.70.1 users from the IAR MyPages system

  • RA0L1 (arm_Renesas_RA0L1_20250305_1.zip)
  • RA2T1 (arm_Renesas_RA2T1_20250714_1.zip)
  • RA4C1 (arm_Renesas_RA4C1_20250213_1.zip)
  • RA8D2 (patches_2025-05-30_RA8D2-M2.zip)
  • RA8M2 (patches_2025-05-30_RA8D2-M2.zip)
  • RA8P1 (arm_Renesas_RA8P1_20250530_1.zip)
  • RA8T2 (arm_Renesas_RA8T2_20250530_1.zip)

• Due to limitation in RASC, Projects fail to build if there are files with same name in a build group. To fix this issue create files with same name in different build groups - For known issues in the tools, please refer to the respective tool's release notes e2 Studio RN

Deprecations

• r_sci_b_lin: Enum SCI_LIN_COMPARE_DATA_SELECT_PRIORITY is now deprecated; use SCI_LIN_COMPARE_DATA_SELECT_PRIMARY instead.

Visit GitHub Issues for this project.

Third Party Software

These third party software solutions are included alongside FSP.

• Amazon coreHTTP: 3.1.1+renesas.0

• Amazon coreMQTT: 2.3.1

• Amazon corePKCS11: 3.6.2

• [Amazon coreJSON: 3.3.0](https...

v6.1.0

Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 6.1.0.

Minimum e2 studio version for FSP 6.1.0 is e2 studio 2025-07

Download the FSP with e2 studio Windows installer for this release, setup_fsp_v6_1_0_e2s_v2025-07.exe, from here.

Download the FSP with e2 studio Linux installer for this release, setup_fsp_v6_1_0_e2s_v2025-07.xz.run, from here. Refer to installation steps for information on installing e2 studio and related software components in a Linux PC.

Download the FSP with e2 studio macOS (Apple Silicon) installer for this release, setup_fsp_v6_1_0_e2s_v2025-07.pkg, from here. Refer to installation steps for information on installing e2 studio and related software components in a macOS PC.

If you are using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for your operating system.

• For Windows download setup_fsp_v6_1_0_rasc_v2025-07.exe from here
• For Linux download setup_fsp_v6_1_0_rasc_v2025-07.xz.run from here
• For macOS (Apple Silicon) download setup_fsp_v6_1_0_rasc_v2025-07.pkg from here

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

• Arm GNU Toolchain: 13.2

• LLVM Embedded Toolchain for Arm: 18.1.3

• IAR Compiler: 9.70.1

• ARM Compiler: 6.23

• QE for Capacitive Touch: 4.2.0

• QE for Display: 3.6.0

• QE for BLE: 1.8.0

• QE for Motor: 1.5.0

• QE for Camera: 1.1.0

• QE for AFE: 2.3.0

• QE for OTA: 2.2.0

• e2 studio: 2025-07

• RASC: 2025-07

• Renesas E2 and E2 Lite: 2.6.2

• SEGGER J-Link: 8.58

New Features

• Added support for RA0L1 devices

  • Includes FPB-RA0L1 board support
  • Includes RSSK-RA0L1 board support

• Added support for RA8T2 devices

  • Includes MCK-RA8T2 board support

• Added GPT polarity inversion control for GTIOCnA/B pins (feature exclusive to RA8P1/RA8T2 hardware)

• Added IPC Semaphore module for multicore RA8 devices

• Platform installer updated to include e2 studio 2025-07

• Support USB PAUD for BareMetal and FreeRTOS

• Added KDF-SHA 256/384 feature for RSIP-E51A and RSIP-E50D PM driver

• Added AES-CCM, HMAC, EdDSA features for RSIP-E31A PM driver

• Added Brainpool curve support for ECDH feature on RSIP-E31A and RSIP-E11A PM driver

• Added Brainpool and Koblitz curve support to ECDSA feature for RSIP-E11A PM driver

• Added support for Post Quantum Crypto (PQC) ML-KEM-512 and ML-KEM-768 key generation, encapsulation and decapsulation

• Added new BGA100, BGA64 part numbers to RA4L1

• Added low-power and wake-up/stand-by features to NFC Reader PTX driver

• Added FSP Solution template for Multicore Flat projects

• Add support for configuring DCDC soft start delay time when waking from Deep Software Standby

• Added support for multiple Ethernet interfaces when using FreeRTOS-Plus-TCP

• Added MP3 decode support for RA devices using the minimp3 library

  • Includes Helium (MVE) acceleration when used on RA8 devices

• Added rm_comms_socket generic comms module for socket-based connections

• Added credit-based shaper (CBS) support for RA8P1 and RA8T2 Ethernet TSN

• Added DMAC support for r_sci_b_spi

• Support single-class hub for BareMetal and FreeRTOS

  • Properties for enabling USB host hub single-class have been added to the HCDC, HHID, and HMSC stacks

• Added FW update for FSBL feature for RSIP-E50D PM driver

• Added ChaCha20 feature for RSIP-E50D PM driver

• Added HMAC-SHA 512/224 and 512/256 key support for RSIP-E31A CM Key Injection

• Released CAVP certified module for RSIP-E11A Protected Mode driver

• Added support for r_sci_lin slave auto synchronization

• Added gPTP support for RA8P1 and RA8T2 devices

Fixes and Improvements

• Updated usage notes for rm_netxduo_wifi noting that use of the NetX Duo FTP addon with the Silex WiFi module is not recommended

• Added constraint to POEG ensure a callback function is defined when interrupt is enabled

• Fix issue with Cellular GM where calling TCP_Sockets_Connect with receiveTimeoutMs less than portMAX_DELAY can cause a NULL pointer dereference

• Fixed r_ble_gtl build issue due to unneeded r_flash_hp.h include

• Disabled Cortex-M85 cache lookups while changing voltage scaling

• The user can now set 'Timer Thread Priority' as '0' in Azure ThreadX

• Fixed RM_BLOCK_MEDIA_RAM FAT table size calculation

• The following OFS Register property names are updated to align with the hardware manual:

  • OFS1_SEL (OFS1 Register Select) Settings
  • OFS3_SEL (OFS3 Register Select) Settings
  • BPS_SEL (BPS Register Select) Settings
  • BANKSEL_SEL (Banksel Register Select) Settings
  • Bank Swap Switch under BANKSEL (Bank Select Register) Settings

• Removed options for hidden property 'Data cache forced write-through' under RA8X Family → Cache settings

• rm_mqtt_onchip_da16xxx: Resolved IAR build warnings when none of the TLS Cipher Suites are selected

• rm_at_transport_da16xxx_uart: Added module constraint to add the dependent UART peripheral module

• Fixed a potential race condition in r_cac that could cause the measurement end interrupt to retrigger erroneously if the measurement was stopped from the CAC interrupt callback and the measurement interval was shorter than the ISR duration

• Update Modbus TCP server to support multi client

• Duplicated MIPI CSI property name changed from 'Frequency Clock Rate Adjust' to 'Data Lane Skew Adjustment'

• Added extern declarations for r_vin, r_mipi_csi, and r_mipi_dsi driver instances

• Fixed minor formatting issue causing C++11 build warnings in ThreadX Port assembly code

• Updated all board URLs to the new format

• R_GPT_InfoGet now returns the correct frequency when the GPT is configured to use GPTCLK

• Updated usage notes for rm_block_media_ram to add basic example of the RAM block media implementation in an application

• Added support for SCI LIN operation mode in pin configuration for RA4M2, RA4M3, RA6M4, and RA6M5

• R_BSP_WarmStart has been moved to src/hal_warmstart.c in new projects

• The Minimal template for RTOS projects now creates a single thread by default

• Fixed two R_VIN property display strings that were swapped, 'Cb to G Coefficient' and 'Cb to B Coefficient'

• Update Ocrypto to v3.9.2

• Fixed rm_littlefs_flash build failure when using r_mram

• Fixed AES-GCM Tag issue in TC3 GCM specification

• Updated PCLKB tooltip for multiple devices to align with specifications in the Hardware Manual

• Added missing GPTE feature support on RA2T1 devices

• Added support for separated frames in lwIP

• Updated display of USBCLK for RA4M1 MCU

• Removed the unsupported USBCLK source for RA6T1 MCU

• Updated tooltip of ICLK, PCLKA, PCLKD, GPTCLK for RA8T2 and RA8P1 devices

• Updated tooltip of PCLKB, PCLKE for RA8E2 MCU

• Corrected the XTAL and SUBCLK mapping for CECCLK on RA6M5 MCU where it was previously interchanged

• Updated FreeRTOS-Plus-TCP version to v4.3.3

• Fixed ECDSA signature generation result that was always the same (no random number component was included) for RSIP-E51A and RSIP-E50D PM drivers

• UART sleep support enabled in DA1453x image

• Stabilization wait time updates for RA4L1:

  • The stabilization time for LOCO, LVD MONITOR1, and LVD MONITOR2 was changed to the value specified in version 1.10 of the RA4L1 User's Manual
  • Changes to OPCCR must only occur when HOCO is stopped or stable

• Added CTSU IP to MCU mapping information in CTSU usage notes

• Register Write Protection:

  • Fix issue where PRCR value was not being restored in R_BSP_OctaclkUpdate
  • Add support for new PRCR field on RA8x2 devices (PRC5: protection for reset register...

v6.0.0

Important Notes for FSP v6.0.0

FSP v6.0.0 adds support for the new dual-core RA8P1 device. Multi-core project support has been added to FSP, though
there are some limitations that are important to note. Updates are coming in the following FSP versions that
will mitigate or significantly reduce these limitations.

Current multi-core project support

When creating an RA8P1 project in e2 studio there are two choices: Renesas RA C/C++ Project and Renesas RA FSP Solution.
To quickly get started with a bare-metal dual-core project, choose Renesas RA FSP Solution which will automatically
generate a Blinky demo where the CM85 core (CPU0) blinks LED1 and the CM33 core (CPU1) blinks LED2. Detailed instructions on
creating and debugging a basic Solution project can be found on the Starting Development page in FSP documentation.

For all other project types, choose Renesas RA C/C++ Project to create projects as before. For multi-core and bootloader
projects, the following procedure must be followed:

1. Create CPU0/bootloader project
2. Build created project
3. Create CPU1/application project
   • During project creation, set Preceding project to the CPU0/bootloader project
4. Build second created project
5. In e2 studio, create a Solution project to link the previous projects together:
6. Click File -> New -> Project...
7. Select C/C++ -> C/C++ Project then click Next
8. Scroll down the list on the right and select Renesas FSP Solution Project (Advanced)
9. Select the CPU1 project when prompted, then click Finish

Notes:

• Linker section boundaries on the Memories tab in the configuration tool are set on Solution creation and must be manually maintained afterward.
  • Bootloader section names have special requirements detailed in the MCUboot FSP usage notes.
• TrustZone is not currently supported in Solution projects.
• It is recommended to start multicore debug sessions using the Launch Group created as part of a Solution project.
• Multicore debugging on RA8P1 is not yet supported in Keil MDK or IAR Embedded Workbench.

ROM register (OFS) changes

Traditionally FSP projects defined all ROM register (hereafter OFS) settings at all times. However, with the increasing
complexity and number of projects in a solution there are now many more options for where each OFS register's settings might
come from. To address this concern, changes were made to the way OFS registers are configured. Here are the key points:

• Each OFS register can be individually Enabled (written) or Disabled (not written)
  • This prevents conflicts when building multiple projects at the same time.
• OFS settings are NOT preserved when upgrading an existing FSP project to v6.0.0
• Secure OFS* (OFS0, OFS1, etc.) registers are enabled by default
  • This ensures users will not accidentally miss the fact that the settings were not preserved if they download to a board that
    happens to have the correct OFS settings already programmed, which could be an issue in a production environment where the
    verification team does not realize that OFS settings were not included in a binary.
• In multi-core projects, regardless of CPU1 settings the OFS register settings are only written on CPU0 projects
• In TrustZone projects, Non-Secure projects cannot write Secure OFS registers regardless of whether they are Enabled or Disabled

We aim to improve the project upgrade and UI tooling in future FSP releases.

Linker script updates

FSP prior to v6.0.0 provided linker scripts that were common to all MCUs. Only having a single linker script per toolchain had
become increasingly complex as the RA MCU family continued to grow and diversify. Starting in FSP v6.0.0, linker scripts are
specific to the toolchain, MCU, and type of project being built. This means that users will need to migrate any linker script
modifications that might have been made when migrating to FSP v6.0.0.

Note: When using a Solution project it is recommended to use the Memories tab in the configuration editor to modify sections where possible.

Other compatibility notices

Of the compatibility breaks noted in the release notes below, we would like to bring attention to the following which are more likely to affect user projects:

• Removal of const from callback p_context declarations
  • This change allows users to use variables for p_context entries without additional casts. However, the change to function prototypes will cause build warnings
    in existing TrustZone projects since the guard functions are under user control and must be manually updated. Please change void const * const p_context to
    void * const p_context as needed to resolve the warnings.
• board_sdram.h has been removed in favor of the more generic bsp_sdram.h
  • SDRAM timings and other options are now set in the configuration editor via BSP properties.
• IAR compiler support has been updated to 9.70.1 in order to utilize a new linker directive. This means that 9.70.1 is the minimum requirement for FSP v6.0.0
  and beyond and using previous versions will result in linker errors.

Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 6.0.0.

Minimum e2 studio version for FSP 6.0.0 is e2 studio 2025-04.1

Download the FSP with e2 studio Windows installer for this release, setup_fsp_v6_0_0_e2s_v2025-04.1.exe, from here.

Download the FSP with e2 studio Linux installer for this release, setup_fsp_v6_0_0_e2s_v2025-04.1.xz.run, from here. Refer to installation steps for information on installing e2 studio and related software components in a Linux PC.

Download the FSP with e2 studio macOS (Apple Silicon) installer for this release, setup_fsp_v6_0_0_e2s_v2025-04.1.pkg, from here. Refer to installation steps for information on installing e2 studio and related software components in a macOS PC.

If you are using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for your operating system.

• For Windows download setup_fsp_v6_0_0_rasc_v2025-04.1.exe from here
• For Linux download setup_fsp_v6_0_0_rasc_v2025-04.1.xz.run from here
• For macOS (Apple Silicon) download setup_fsp_v6_0_0_rasc_v2025-04.1.pkg from here

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

• Arm GNU Toolchain: 13.2

• LLVM Embedded Toolchain for Arm: 18.1.3

• IAR Compiler: 9.70.1

• ARM Compiler: 6.23

• QE for Capacitive Touch: 4.1.0

• QE for Display: 3.5.0

• QE for BLE: 1.7.0

• QE for Motor: 1.4.0

• QE for Camera: 1.0.0

• QE for AFE: 2.3.0

• QE for OTA: 2.1.0

• QE for USB: 2.0.0

• e2 studio: 2025-04.1

• RASC: 2025-04.1

• Renesas E2 and E2 Lite: 2.5.8

• SEGGER J-Link: 8.44.1

Compatibility Breaks

• Deprecated RYZ cellular modules have been removed

• Renamed BSP_CFG_UCK_DIV to BSP_CFG_UCLK_DIV

• Renamed BSP_CFG_UCK_SOURCE to BSP_CFG_UCLK_SOURCE

• Renamed BSP_CFG_U60CK_SOURCE to BSP_CFG_USB60CLK_SOURCE

• Renamed BSP_CFG_U60CK_DIV to BSP_CFG_USB60CLK_DIV

• Renamed BSP_CFG_OCTA_SOURCE to BSP_CFG_OCTACLK_SOURCE

• Renamed BSP_CFG_OCTA_DIV to BSP_CFG_OCTACLK_DIV

• Removed all deprecated ELC event enumerated values

• Deprecated R_XSPI_Type...

v5.9.0

Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 5.9.0.

Minimum e2 studio version for FSP 5.9.0 is e2 studio 2025-04

Download the FSP with e2 studio Windows installer for this release, setup_fsp_v5_9_0_e2s_v2025-04.exe, from here.

Download the FSP with e2 studio Linux installer for this release, setup_fsp_v5_9_0_e2s_v2025-04.xz.run, from here. Refer to installation steps for information on installing e2 studio and related software components in a Linux PC.

Download the FSP with e2 studio macOS (Apple Silicon) installer for this release, setup_fsp_v5_9_0_e2s_v2025-04.pkg, from here. Refer to installation steps for information on installing e2 studio and related software components in a macOS PC.

If you are using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for your operating system.

• For Windows download setup_fsp_v5_9_0_rasc_v2025-04.exe from here
• For Linux download setup_fsp_v5_9_0_rasc_v2025-04.xz.run from here
• For macOS (Apple Silicon) download setup_fsp_v5_9_0_rasc_v2025-04.pkg from here

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

• Arm GNU Toolchain: 13.2

• LLVM Embedded Toolchain for Arm: 18.1.3

• IAR Compiler: 9.60.4

• ARM Compiler: 6.23

• QE for Capacitive Touch: 4.1.0

• QE for Display: 3.5.0

• QE for BLE: 1.7.0

• QE for Motor: 1.4.0

• QE for Camera: 1.0.0

• QE for AFE: 2.3.0

• QE for OTA: 2.1.0

• QE for USB: 2.0.0

• e2 studio: 2025-04

• RASC: 2025-04

• Renesas E2 and E2 Lite: 2.4.8

• SEGGER J-Link: 8.12f

New Features

• Added support for RA8E2 devices

  • Includes EK-RA8E2 board support

• Support RA6M5 BGA-100pin

• Add new 64 and 36 BGA part numbers with operating temperatures of -40 to +105°C for RA6E2 and RA4E2

• Doubled maximum bitrate in r_sci_b_spi

• Added Oberon ocrypto support on RA2E1 devices

  • Includes MCUboot integration

• Added support for RA0E2 devices

  • Includes FPB-RA0E2 board support

• Added support for RA2L2 devices

  • Includes EK-RA2L2 board support

• Platform installer updated to include e2 studio 2025-04

• Support USB Type-C driver for RA2L2

• Added support for Firmware Update using the First-Stage Bootloader (FSBL) to RA8D1, RA8M1, and RA8T1

• Release assets now use SHA-256 checksums instead of MD5

• Added support for SCI LIN

• Added NFC IoT Reader driver for PTX105R module

• IAR compiler updated to version 9.60.4

• Add H/W Acceleration for Ocrypto ECB for RA2E1

• Added Ed25519/EdDSA support to RSIP-E51A Protected Mode (RA8D1, RA8M1, RA8T1)

• Added ECDH secp256r1 and KDF-SHA256 to RSIP-E11A Protected Mode (RA4L1)

• Added HMAC Suspend/Resume support to RSIP-E11A Protected Mode (RA4L1)

• Added encryption key size enumeration to RSIP API

• Add H/W Acceleration for Ocrypto CBC and CTR for RA2E1

Fixes and Improvements

• Resize interrupt vector table based on the number of ICU slots allocated

• Updated the board URL for FPB-RA4T1 and FPB-RA6T3

• Constraint logic is updated for 'Update area block erase size' in rm_mcuboot_ext_memory_ospi_b module

• The display name for the SAU SPI 'Operation Clock' option has been updated as per HWM

• Module constraints have been added to check for dependent rm_littefs_flash and rm_littlefs_spi_flash modules

• Updated module URL for rm_comms_spi

• Fixed issue where the I3C peripheral could pull SCL low during initialization of the driver

• Segger JLink version updated to v8.12f

• Correct value of BSP_FEATURE_SCI_UART_FIFO_CHANNELS to 0x219 for RA6E1

• Sector Erase Size and Block Erase Size properties upper limit is added in OSPI module.

• Added parameter checking to r_sci_b_lin and r_sau_lin to return an error when a read API is called in slave mode, but the slave has not successfully received a header yet to enable data reception

• Remove HOCO from USBCLK source option in RA4L1

• Removed extra semicolons in example code of I2C modules

• Fixed issue with GPT functions assigned to P815 and P814 not being output for RA6E2 and RA4E2 36 pin devices

• Improved constraints and default values in LwIP module properties

• Updated FSBLCLK clock options as per RA8x1 hardware manual

• Fixed addresses for P8014PFS and P8015PFS

• Changed RA2L2 USB_CC1 and USB_CC2 pins to Analog pins

• Fix potential race condition in R_GPT_DutyCycleSet parameter checking when calling immediately after R_GPT_PeriodSet

• Fixed the higher 8-bit period calculation of r_tau module

• Fixed enums lpm_snooze_request_t and lpm_snooze_end_t for RA4L1

• FSP Common API updated to v1.11.0

• MCUboot documentation is updated to use the SmartBundle for project linkage

• Canceled deprecation of SAU SPI continuous mode and optimized code size for single transfer mode

• Updates to the r_i3c module include the following:

  • Added ability to enable clock stall during read transitions for devices which supports the SCSTLCTL.TRAPE bit
  • Fixed HDR_DDR selection for RA4L1

• Add BSP overrides for LVD enumerations for devices that did not already have them

• Fixed error in RSIP-E11A Protected Mode SHA and HMAC single part operation APIs when inputting a message longer than 128 bytes

Known Issues

• RA0E1:

  • e2 studio projects automatically reset compiler optimization to a Size setting on every generate or build operation
  • Add optimization flags (e.g. -O0) manually to 'Other optimization flags' to override the -Oz setting
  • HS400x, ZMOD4xxx, and OB1203 sensors cannot be used on RA0E1
  • FS1015 and FS3000 sensors do not support SAU-I2C driver

• Selecting 'Safely Remove Hardware and Eject Media' on Windows and eject the mass storage (PMSC), when

  using USBX composite device (PCDC+PMSC), the Windows Explorer for PMSC does not disappear.

• PMSC may not work properly when USBX Composite Device (PCDC+PMSC) is connected to specific Linux OS

  (USB Host).

• EWARM support for RA0E2 and RA2L2

  • EWARM version 9.60.4 does not contain support for RA0E2 and RA2L2. To develop with IAR for these devices, it is necessary to install support patch file for RA0E2(arm_Renesas_RA0E2_20240715_1.zip) and RA2L2(arm_Renesas_RA2L2_patch_20240510_1.zip) which can be downloaded by EWARM v9.60.4 users from the IAR MyPages system

• For known issues in the tools, please refer to the respective tool's release notes e2 Studio RN

• rm_rrh62000 does not support r_iic_master on RA8 series MCU

Deprecations

• The following modules/features have been deprecated and will be removed in FSP v6.0.0:

• FS2012 and OB1203 sensor modules

• RYZ cellular modules

• ZMOD4410 Odor mode

• ZMOD4510 OAQ 1st Gen mode

Note

• Updated lwIP HTTP Server usage notes to clarify HTTPS is not currently supported

Visit GitHub Issues for this project.

Third Party Software

These third party software solutions are included alongside FSP.

• Amazon coreHTTP: 3.1.1+renesas.0

• Amazon coreMQTT: 2.3.1

• Amazon corePKCS11: 3.6.2

• Amazon coreJSON: 3.3.0

• Amazon FreeRTOS+FAT: f834aee4

• [Amazon FreeRTOS Cellular Interface: 1.4.0](https://github.c...

v5.8.0

Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 5.8.0.

Minimum e2 studio version for FSP 5.8.0 is e2 studio 2025-01

Download the FSP with e2 studio Windows installer for this release, setup_fsp_v5_8_0_e2s_v2025-01.exe, from here.

Download the FSP with e2 studio Linux installer for this release, setup_fsp_v5_8_0_e2s_v2025-01.xz.run, from here. Refer to https://en-support.renesas.com/knowledgeBase/19934358 for information on installing e2 studio and related software components in a Linux PC.

Download the FSP with e2 studio macOS (Apple Silicon) installer for this release, setup_fsp_v5_8_0_e2s_v2025-01.pkg, from here.

If you are using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for your operating system.

• For Windows download setup_fsp_v5_8_0_rasc_v2025-01.exe from here
• For Linux download setup_fsp_v5_8_0_rasc_v2025-01.xz.run from here
• For macOS (Apple Silicon) download setup_fsp_v5_8_0_rasc_v2025-01.pkg from here

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

• Arm GNU Toolchain: 13.2

• LLVM Embedded Toolchain for Arm: 18.1.3

• IAR Compiler: 9.60.3

• ARM Compiler: 6.23

• QE for Capacitive Touch: 4.0.0

• QE for Display: 3.5.0

• QE for BLE: 1.7.0

• QE for Motor: 1.4.0

• e2 studio: 2025-01

• RASC: 2025-01

• Renesas E2 and E2 Lite: 2.4.8

• SEGGER J-Link: 8.12.3

New Features

• Added support for RA4L1 including the following development boards:

  • EK-RA4L1
  • RSSK-RA4L1

• Added new CTSU features Automatic Judgement and Multiple Electrode Connection (RA4L1 only)

• Added SAU LIN support

• Added support for USBX Host Audio (HAUD) class

• Added COMMS SPI Module

• Added support for MCUBoot dual bank swap without device reset

• Release CAVP certified module for RSIP Protected Mode driver

• Added support for AES-192, SHA-224, 512/224, 512/256 and HMAC-SHA 224 functionality to the RSIP Protected Mode on RA8M1, RA8D1, and RA8T1

• RSIP Compatibility Mode updates to support additional key types for Key Injection including:

  • HMAC-SHA 224 for RA8M1/D1/T1
  • HMAC-SHA 224, ECC brainpoolP256r1 (Private key only) and ECC secp256k1 (Private key only) for RA4L1

Fixes and Improvements

• Added constraint message when dependent modules are missing in rm_motor_current stack

• Added missing constraint message for reference voltage selection in r_adc_d

• Fixed issue with allowing invalid values for property 'number of transfer sectors' in r_usb_pmsc module

• Added constraint message when dependent modules are missing in r_usb_pvnd stack

• r_gpt

  • Fixed build errors with valid Compare Match A/B value
  • Added fix to avoid invalid values in properties

• Added fix to avoid invalid values in the properties of rm_motor_driver

• Added fix to avoid invalid values in the properties of rm_motor_120_degree

• Updated PSA Crypto to support plaintext ECC keygen for SCE9

• Updated UM to show the default value of 'Use low voltage mode' property

• Fixed issues with RA8E1 clocks tab

• Fixed unsupported voltage threshold options available in the properties of r_lvd for RA8E1

• Reference to 'r_canfdlite' added to CANFD Usage Notes page

• Fixed potential race condition in CANFD RXMB read operation

• Added constraint message when dependent modules are missing in rm_hs400x stack

• r_usb_hcdc_ecm

  • Fixed issue where an Ether constraint message was displayed even when the Ether module was not added to the stack
  • Updated constraint message for heap

• Fixed missing NetX crypto enumeration on RA4E1 and RA6E1

• Improved AES code size

• Improved constraint message for r_tau

• J-Link version updated to version 8.10l

• Platform installer updated to include e2 studio 2025-01

• Updates to FreeRTOS modules including the below (see Third Party Software section for versioning):
  - FreeRTOS
  - FreeRTOS Kernel
  - FreeRTOS-Plus-TCP
  - FreeRTOS-Cellular Interface
  - coreJSON
  - coreMQTT
  - coreHTTP
  - corePKCS11

• Improved the accuracy of CTSU2 correction calculation

• Fixed issue with Developer Assistance for rm_rrh47000

• SEGGER emWin updated to v6.48

• Fixed issue in CGC where PLL settings were being applied to PLL2

• E2 Emulator and E2 Emulator Lite version updated to 2.4.8

• AWS Cellular Interface on GM (rm_cellular_gm_aws):

  • Updated constraint logic for certain properties to allow only integers.
  • Added constraints to check for dependent stacks.

• SCI_B UART (r_sci_b_uart):

  • Updated module constraint for CTS/RTS Section.

• Fix to allow A4 and A5 pins to configure as both GPIO and USB in RA4E2 and RA6E2 36 pin devices

• Fixed an issue on rm_netxduo_wifi where once a socket connect fails it cannot be reconnected

• Fixed baudrate update issue with DA16XXX Wi-Fi module and improved baremetal performance

• Remove setting of the unused FLWAITR register in r_flash_lp

• Fixed issue where LVD security attribution registers were not set correctly in TrustZone projects

• Fixed pingroup selection for IICA in RA0E1

• E2 Emulator and E2 Emulator Lite version updated to 2.4.8

• Fixed a build warning in the USBX Host port code

• Removed redundant BSP 'Error Log' configuration (superseded by logging option in 'Assert Failures' property)

• Added LVD1 detection level change stabilization delay per RA0E1 technical update

• CANFD data rate limit increased to 8Mbps per various 01/2025 technical updates

• JLink version updated to 8.12c

Known Issues

• RA0E1:

  • e2 studio projects automatically reset compiler optimization to a Size setting on every generate or build operation
  • Add optimization flags (e.g. -O0) manually to 'Other optimization flags' to override the -Oz setting
  • HS400x, ZMOD4xxx, and OB1203 sensors cannot be used on RA0E1
  • FS1015 and FS3000 sensors do not support SAU-I2C driver

• Selecting 'Safely Remove Hardware and Eject Media' on Windows and eject the mass storage (PMSC), when

  using USBX composite device (PCDC+PMSC), the Windows Explorer for PMSC does not disappear.

• PMSC may not work properly when USBX Composite Device (PCDC+PMSC) is connected to specific Linux OS

  (USB Host).

• EWARM support for RA4L1:

  • EWARM version 9.60.3 does not contain support for RA4L1. To develop with IAR for this device, it is necessary to install support patch files (arm_Renesas_RA4L1_patch_20250117_1.zip) which can be downloaded by EWARM v9.60.3 users from the IAR MyPages system.

Deprecations

• FS2012 and OB1203 sensor modules

• RYZ cellular modules

• ZMOD4410 Odor mode

• ZMOD4510 OAQ 1st Gen mod

Visit GitHub Issues for this project.

Third Party Software

These third party software solutions are included alongside FSP.

• Amazon coreHTTP: 3.1.1+renesas.0

• Amazon coreMQTT: 2.3.1

• Amazon corePKCS11: 3.6.2

• Amazon coreJSON: 3.3.0

• Amazon FreeRTOS+FAT: f834aee4

• Amazon FreeRTOS Cellular Interface: 1.4.0

• Amazon FreeRTOS Kernel: 11.1.0

• Amazon FreeRTOS+TCP: 4.2.2

• Amazon OTA: 3.4.0

• Arm CMSIS6: 6.1.0

• Arm CMSIS-NN: 6.0.0

• Arm CMSIS-DSP: 1.16.2

• [Arm Mbed TLS: 3...